-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Averatek to Present ‘Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs' at IPC APEX EXPO
December 23, 2021 | AveratekEstimated reading time: 2 minutes
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, “Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs” during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Soldering is the preferred method for mounting SMDs and connecting circuit boards. But that brings in processing challenges. Soldering to aluminum requires an additional surface treatment or the use of conductive epoxy. These are cost-prohibitive and have reliability challenges and existing products like solders, fluxes, tack agents, cleaners etc. are formulated for Cu-PCBs and do not work on aluminum.
An advanced surface treatment technology will be presented that addresses all these constraints. Once printed on aluminum using conventional printing techniques such as screen, stencil etc., it is cured thermally in a convection oven at low temperatures, leaving a non-conductive deposit on the pads. This is followed by conventional process i.e. print solder over the treated pads, place components and then reflow resulting in finished Al-PCBs. It can also be used to solder Al-PCBs to flexible and rigid Cu-PCBs.
This is a paradigm shift in the industry which opens up many new applications, including those in the RFID, LED, and automotive industries. We will show solder cross-sections and shear data on the soldered joints, including Al-PET to Cu-PCB, Al-PET to Cu-Polyimide using aluminum metallization with low temperature Bi-Sn-Ag solders.
Kadiwala is a process development and project management leader in developing innovative products from laboratory concepts to large-scale manufacturing. He has 15+ years of multi-national experience with utilizing emerging technologies in strategic roles.
Kadiwala holds a BS in Chemical Engineering from the University of Mumbai, and a Master’s degree in Manufacturing Systems Engineering from the University of Wisconsin.
Merchant has 20 years of successful deliverables in PCBs, semiconductor packaging, metallurgy, welding consumables and processes, superconductors, fuel cells, batteries, solar cells, and failure analysis. His work has resulted in six US patents, three US patent applications under review, and 25 technical publications.
Merchant holds Doctorate and Master’s degree in Materials Engineering from the University of Illinois, and a Bachelor of Technology in Metallurgical Engineering from IIT of Bombay.
About Averatek
Averatek is a technology innovation company that develops and manufactures key chemistries, and licenses their associated advanced processes, for: very high-density printed circuit boards, semiconductor packaging, RF and millimeter-wave passive components, simplified assembly to aluminum. For more information, visit www.averatek.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.