Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Eltek Names Ron Freund as Chief Financial Officer
December 31, 2021 | PRNewswireEstimated reading time: 1 minute
Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that its Board of Directors has named Ron Freund as its Chief Financial Officer, effective January 1, 2022. Freund will succeed Mr. Alon Mualem, who resigned to pursue a business opportunity.
Prior to joining Eltek, Freund served as the CFO of Ophir Tours Ltd. from 2015 to 2021. From 2011 to 2014, Freund served as the CFO of Middle East Tube Company Ltd., an Israeli public company, traded on the Tel Aviv Stock Exchange (TASE). In previous roles, Freund served as Deputy CEO and CFO of Soltam Systems LTD. and as a Senior Partner at Ernst & Young Israel. Freund holds a B.A. degree in Accounting and Economics from the Hebrew University, Jerusalem, and is a licensed CPA (Israel).
Eli Yaffe, CEO, commented: "The entire management team at Eltek is excited to have Mr. Freund on board and we are confident that he will be an important factor in Eltek's growth and future success. I would also like to take this opportunity to thank Alon Mualem for his contribution to our company, mainly with respect to Eltek's successful turnaround that we implemented during the last 3 years and wish him all the best in his next endeavor."
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Ibiden Opens Ono Plant to Expand AI Server IC Substrate Production Capacity
10/14/2025 | IBIDENIBIDEN Co., Ltd. announces that it held the opening ceremony for its Ono Plant on October 10, 2025 in Ono Town, Ibi District, Gifu Prefecture. Construction work and preparations for mass production at the plant had been underway.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.
Capital Electro-Circuits Achieves ITAR Registration to Strengthen Aerospace and Defense Capabilities
10/06/2025 | Capital Electro-CircuitsCapital Electro-Circuits, Inc. (CEC), a U.S.-based manufacturer of mission-critical printed circuit boards since 1985, announced that it is now officially registered with the U.S. Department of State, Directorate of Defense Trade Controls (DDTC) under the International Traffic in Arms Regulations (ITAR).