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Eltek Names Ron Freund as Chief Financial Officer
December 31, 2021 | PRNewswireEstimated reading time: 1 minute

Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that its Board of Directors has named Ron Freund as its Chief Financial Officer, effective January 1, 2022. Freund will succeed Mr. Alon Mualem, who resigned to pursue a business opportunity.
Prior to joining Eltek, Freund served as the CFO of Ophir Tours Ltd. from 2015 to 2021. From 2011 to 2014, Freund served as the CFO of Middle East Tube Company Ltd., an Israeli public company, traded on the Tel Aviv Stock Exchange (TASE). In previous roles, Freund served as Deputy CEO and CFO of Soltam Systems LTD. and as a Senior Partner at Ernst & Young Israel. Freund holds a B.A. degree in Accounting and Economics from the Hebrew University, Jerusalem, and is a licensed CPA (Israel).
Eli Yaffe, CEO, commented: "The entire management team at Eltek is excited to have Mr. Freund on board and we are confident that he will be an important factor in Eltek's growth and future success. I would also like to take this opportunity to thank Alon Mualem for his contribution to our company, mainly with respect to Eltek's successful turnaround that we implemented during the last 3 years and wish him all the best in his next endeavor."
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Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.