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Cirtronics Welcomes Patrick Moody as New CEO to Lead Next Era of Growth

09/12/2024 | Cirtronics
Cirtronics, a leading advanced contract manufacturing firm, is excited to announce the appointment of Patrick Moody as the new President, Chief Executive Officer (CEO), and Board of Directors member. Founder and former CEO Gerardine Ferlins will continue to contribute to Cirtronics’ legacy by remaining on the company’s Board of Directors.

Connect With a New Job at JobCONNECT007 

09/10/2024 | I-Connect007 Editorial Team
jobCONNECT007 features job openings for positions that span the entire circuit board supply chain. Whether you’re involved in design, fabrication, assembly, test, or material development or distribution, this handy resource can help you find that new gig. Once you find a position that’s a perfect fit, you can submit your resume directly to the hiring manager simply by clicking on the ad.

NASA, Boeing Welcome Starliner Spacecraft to Earth, Close Mission

09/10/2024 | NASA
NASA and Boeing safely returned the uncrewed Starliner spacecraft following its landing at 10:01 p.m. MDT Sept. 6 at White Sands Space Harbor in New Mexico, concluding a three-month flight test to the International Space Station.

Peter Wennink Appointed Member of the Supervisory Board of VDL Groep

09/03/2024 | VDL Groep
Peter Wennink has joined the Supervisory Board of VDL Groep. On 1 September 2024, the 67-year-old former CEO of chip machine maker ASML joined the Supervisory Board of the industrial family business with its headquarters in Eindhoven.

Quiet Power: An Evolution in PCB Design Costs

09/04/2024 | Istvan Novak -- Column: Quiet Power
In this column, I want to cover my experiences, particularly where costs are concerned, with printed circuit boards from the 1960s to the present day. I grew up in an apartment building in downtown Budapest, where I began doing hobby projects building circuits from our kitchen table. Now, I’m lecturing about the most recent advances in signal integrity at Oxford University. We’ve come a long way. Over the decades, new technologies allowed users to have more layers, lower-loss dielectrics, fine-pitch surface connections, blind and buried vias, and HDI and HDI+ board constructions that allow us to design higher-performing systems. I expect this trend to continue.
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