-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S Make Cars Fit for the Transport of Tomorrow
January 5, 2022 | AT&SEstimated reading time: 2 minutes

For vehicles to operate as autonomously as possible in the future, they must meet completely new requirements in data processing and sensor technology. State-of-the-art technology by AT&S enables high-resolution scanning of the surroundings as well as processing and transferring the data volume incurred. In January, the high-tech group from Austria will present its latest developments in this area at the CES Consumer Electronics Show.
Cars that operate autonomously and without errors are a cornerstone of concepts aiming to make transport greener and safer. From today’s perspective, this is still a distant dream as the technical challenges are enormous and legal framework conditions are yet to be established. Autonomous vehicles permanently need accurate information about their surroundings, sufficient computing power to process this flood of data and high-speed data connections to communicate with traffic lights or other cars. As the share of electronics in cars increases, little space is available and miniaturisation is continuously gaining importance.
Sensors for Cars
AT&S has developed solutions that all leading automotive manufacturers use to cope with these challenges: For example, new processes allow the integration of antennas for high-frequency signals directly into printed circuit boards with virtually no losses. This allows building radar sensors featuring significantly higher resolution than current products. As a result, self-driving cars of the future will be able to reliably identify small objects such as small animals or things on the road.
Likewise, high-resolution cameras are used to collect reliable information about the surrounding environment. AT&S benefits from its long-standing experience in the smartphone market, which enables us to integrate high-resolution optical sensors directly into the printed circuit boards. As a result, extremely robust systems are created which can identify pedestrians or road conditions very quickly since the data can be processed directly in the camera module.
V2X Communication
In order for self-driving cars to capitalise on their advantages, coordination between them will be necessary. The data collected by a vehicle must be shared with other road users. Moreover, traffic lights or toll booths also have to pass on information to vehicles. This requires wireless communication channels that transmit data with high bandwidth and without delay. The new 5G standard meets these requirements. With its HDI and substrate-like printed circuit boards (SLP), AT&S provides the basis for such complex communication channels which meet even the highest demands very efficiently.
The less human intervention is intended, the more complex the decisions that need to be made by driver assistance systems for self-driving cars. Different processors and processing units that operate reliably and fast are required for general and specialised tasks. AT&S interconnect solutions combine the necessary data processing capacity and computing power in a very small space while at the same time meeting the demanding automotive requirements.
AT&S at the CES Las Vegas
AT&S will be presenting these and many other solutions for the first time at one of the world’s most influential technology events – the Consumer Electronics Show in Las Vegas. Visit us from January 5 to 8, 2022 at our booth #51134 in the Austria Pavilion (Venetian Expo (formerly Sands), Level 2, Halls A-C) and find out everything about how AT&S is helping to shape the future.
Suggested Items
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/15/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
04/15/2025 | Real Time with...IPC APEX EXPOThings are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.
Real Time with... IPC APEX EXPO 2025: Exploring LCP Materials with Matrix Electronics
04/15/2025 | Real Time with...IPC APEX EXPONolan Johnson introduces Robert Berg from Matrix Electronics, highlighting the company's focus on high-speed, low-loss flexible materials, especially LCP materials. LCP (liquid crystal polymer) is a thermal plastic with unique properties that make it ideal for advanced PCB applications. Despite processing challenges, its stability and FDA approval for medical use drive interest in aerospace and medical markets.
Explore TRI's Test and Inspection Innovations at ElectroneX
04/15/2025 | TRIGPC Electronics, TRI's industry partner, will participate in the ElectroneX Electronics Design & Assembly Expo 2025 at the Melbourne Convention & Exhibition Centre, Australia, on May 7–8, 2025.
IPC Welcomes Exemptions to Reciprocal Tariffs
04/14/2025 | IPCIPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO: