Dan’s Biz Bookshelf: 'Hidden Potential: The Science of Achieving Greater Things'
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
It’s Only Common Sense: 20 Lessons in 20 Years—A Career in Common Sense
iNEMI's Call-for-Participation Webinar; Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4
January 5, 2022 | iNEMIEstimated reading time: 1 minute
Join us January 20 or 21 to learn more about Phase 4 of iNEMI’s new Panel Level Package Fine Pitch Substrate Inspection/Metrology Project.
Heterogeneous SiP packages are increasingly used as electronic packaging solutions and these packages require finer circuitry patterns within the substrate/interposer (lines and spaces
iNEMI’s Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4 will study defect detection plus line width and space measurement for circuit patterns below 5um. The project will provide a better understanding of current AOI measurement and inspection systems and the latest technology trends for AOI solutions. The ultimate goal is to drive the readiness of innovative AOI inspection systems to reduce the defect escape risk for finer pattern substrates and interposers.
Registration
This webinar is open to the industry. Two sessions (with the same content) are scheduled; advance registration is required. Click on one of the links below to register. For additional information, contact Masahiro Tsuriya.
Session 1 (Americas/Europe/APAC)
Thursday, January 20
- 8:00-9:00 a.m. EST (Americas)
- 2:00-3:00 p.m. CET (Europe)
- 10:00-11:00 p.m. JST (Japan)
Session 2 (APAC/Americas)
Friday, January 21
- 10:00-11:00 a.m. JST (Japan)
- 5:00-6:00 p.m. PST (Americas) on Thursday, January 20
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ViTrox Unveils Smart 3D AOI Solutions, Pioneering Dual-Sided Inspection and Robotic Vision Solutions for Back-end Assembly Processes
08/04/2025 | ViTroxViTrox, which strives to be the World’s Most Trusted Technology Company, proudly announces the launch of its new-generation innovations in Automated Optical Inspection (AOI) technology for back-end assembly processes.
TRI Unveils New Platform for Diverse Board Sizes
07/14/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
ZETWERK Enhances Manufacturing Capabilities with TRI
06/04/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce that ZETWERK Electronics has integrated TRI's Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) solutions into its state-of-the-art manufacturing facility in Tamil Nadu.