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Join us January 20 or 21 to learn more about Phase 4 of iNEMI’s new Panel Level Package Fine Pitch Substrate Inspection/Metrology Project.
Heterogeneous SiP packages are increasingly used as electronic packaging solutions and these packages require finer circuitry patterns within the substrate/interposer (lines and spaces
iNEMI’s Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4 will study defect detection plus line width and space measurement for circuit patterns below 5um. The project will provide a better understanding of current AOI measurement and inspection systems and the latest technology trends for AOI solutions. The ultimate goal is to drive the readiness of innovative AOI inspection systems to reduce the defect escape risk for finer pattern substrates and interposers.
Registration
This webinar is open to the industry. Two sessions (with the same content) are scheduled; advance registration is required. Click on one of the links below to register. For additional information, contact Masahiro Tsuriya.
Session 1 (Americas/Europe/APAC)
Thursday, January 20
- 8:00-9:00 a.m. EST (Americas)
- 2:00-3:00 p.m. CET (Europe)
- 10:00-11:00 p.m. JST (Japan)
Session 2 (APAC/Americas)
Friday, January 21
- 10:00-11:00 a.m. JST (Japan)
- 5:00-6:00 p.m. PST (Americas) on Thursday, January 20
