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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Isola Supports High-Speed Digital Circuits at IPC APEX EXPO 2022
January 10, 2022 | IsolaEstimated reading time: 2 minutes
Isola Group, a leading global manufacturer of copper-clad laminates and dielectric prepregs for printed circuit boards (PCBs), will be on hand at the IPC APEX EXPO 2022 exhibition with examples of its high-performance circuit materials for high-speed digital circuits, including Tachyon 100G and I-Tera MT40 materials. The exhibition is scheduled for January 25-27, 2022, at the San Diego Convention Center (San Diego, CA) and represents one of North America’s largest annual gatherings of electronics manufacturing technology and PCB manufacturers.
Isola Group will be well represented at IPC APEX EXPO Booth No. 3233, offering insights and guidance on the use of its outstanding circuit materials, in particular Tachyon 100G ultra low loss laminate and prepreg materials and I-Tera MT40 (RF/MW) very low-loss laminate and prepreg materials. The circuit materials provide stable foundations for high-speed digital circuits, including multilayer circuits in which size must be minimized.
Tachyon 100G circuit materials maintain dielectric constant (Dk) of 3.02 in the z-axis (thickness) with low dissipation factor (Df) of 0.0021 at 10 GHz across a wide temperature range of -55 to +125°C. With low z-axis coefficient of thermal expansion (CTE), Tachyon circuit materials are optimized with spread glass to provide the substrate stability needed for low-jitter data rates to 100 GB/s. They are available in laminate and prepreg forms for constructing compact high-speed-digital (HSD) multilayer circuits and circuit assemblies.
I-Tera MT40 laminates and prepregs are characterized by a z-axis Dk of 3.45 and low Df of 0.0031 at 10 GHz, both of which remain stable with temperatures from -55 to +125°C. They are cost-effective alternatives to more-difficult-to-process PTFE circuit materials for high-speed digital multilayer and hybrid high-speed digital and RF/microwave multilayer circuits. In fact, they are FR-4 process compatible for ease of hybrid circuit fabrication.
Regarding the two materials, Sean Mirshafiei, Chief Sales & Marketing Officer, said: “Circuit designers are pressing for more bandwidth, higher frequencies, and faster digital speeds for automotive, communications, industrial, medical, and military circuits. Both Tachyon 100G and I-Tera laminates and prepregs provide the characteristics needed for consistent outstanding circuit performance at the highest data rates.”
Isola Group representatives at IPC APEX EXPO will welcome visitors to their booth with details and advice on the use of Tachyon 100G, I-Tera MT40, and other circuit materials well suited for high-speed digital circuits and high-frequency millimeter-wave (mmWave) circuits through W-band frequencies to 110 GHz. The circuit materials are FR-4 process compatible and RoHS-compliant and make cost-effective alternatives to more-difficult-to-process PTFE circuit materials for high-speed, high-frequency circuits. For more information about any of their materials, please visit the Isola website at www.isola-group.com.
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.