Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Strategic Partner Invests in Schweizer China
January 11, 2022 | Schweizer Electronic AGEstimated reading time: 1 minute
The fourth quarter of 2021 resulted in significant new orders for Schweizer of around EUR 47 million. This means that a record order intake of EUR 175.2 million was achieved last year - more than twice as much as in the previous year and 20 percent above the record year of 2015.
This can be attributed in particular to the technological and now global setup of the company, so that the record order intake was achieved despite the global shortage of components.
Particularly noteworthy are orders in the double-digit millions for our chip embedding technology p² Pack. This disruptive technology supports the efficiency of hybrid 48-volt drives in automobiles and also enables a reduction in semiconductor need with higher performance at the same time. This is a decisive competitive advantage, especially in the view of the high global demand for semiconductors.
The negotiations with the strategic investor WUS Printed Circuits (Kunshan) for a direct investment in Schweizer Electronic China were successfully concluded at the beginning of January, a few days after our expected date. The transaction takes place through a 12.8 percent capital increase at the Chinese subsidiary. The inflow of funds from the capital increase will amount to CNY 75 million (around EUR 10.5 million) and is subject to the approval of an extraordinary shareholders' meeting of the investor, which is expected to take place on January 27, 2022. Discussions with another investor are ongoing. We will inform you about the progress in a timely manner.
The combination of the high order intake and a strengthening of the equity base will make it possible to finance the high growth-related working capital. With this, SCHWEIZER is heading strengthened into the year 2022.
We will communicate the provisional figures for the 2021 consolidated financial statements as soon as we finish our annual financial statements.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.