-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Strategic Partner Invests in Schweizer China
January 11, 2022 | Schweizer Electronic AGEstimated reading time: 1 minute
The fourth quarter of 2021 resulted in significant new orders for Schweizer of around EUR 47 million. This means that a record order intake of EUR 175.2 million was achieved last year - more than twice as much as in the previous year and 20 percent above the record year of 2015.
This can be attributed in particular to the technological and now global setup of the company, so that the record order intake was achieved despite the global shortage of components.
Particularly noteworthy are orders in the double-digit millions for our chip embedding technology p² Pack. This disruptive technology supports the efficiency of hybrid 48-volt drives in automobiles and also enables a reduction in semiconductor need with higher performance at the same time. This is a decisive competitive advantage, especially in the view of the high global demand for semiconductors.
The negotiations with the strategic investor WUS Printed Circuits (Kunshan) for a direct investment in Schweizer Electronic China were successfully concluded at the beginning of January, a few days after our expected date. The transaction takes place through a 12.8 percent capital increase at the Chinese subsidiary. The inflow of funds from the capital increase will amount to CNY 75 million (around EUR 10.5 million) and is subject to the approval of an extraordinary shareholders' meeting of the investor, which is expected to take place on January 27, 2022. Discussions with another investor are ongoing. We will inform you about the progress in a timely manner.
The combination of the high order intake and a strengthening of the equity base will make it possible to finance the high growth-related working capital. With this, SCHWEIZER is heading strengthened into the year 2022.
We will communicate the provisional figures for the 2021 consolidated financial statements as soon as we finish our annual financial statements.
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.