-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Electronics Solutions to Present Five Papers at IPC APEX EXPO 2022
January 11, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will present five papers at the IPC APEX EXPO Technical Conference taking place January 25-27 at the San Diego Convention Center in San Diego, California.
The papers, authored by MacDermid Alpha’s leading industry experts, will discuss materials and solutions in the assembly process, PCB fabrication for next-generation technology, and materials to meet the goals of reliability, performance, cost efficiency and sustainability.
Four of the papers are part of the Assembly, Materials, and Environment Track. The focus of these presentations includes studies on material capabilities and performance attributes of conformal coatings and liquid fluxes, a comparison of vacuum soldering and conventional reflow processes and the impact on solder joint reliability and voiding, as well as a sustainability study on bio-based polymers versus synthetic materials.
A paper in the PCB Fabrication and Materials Track will cover the latest research on material performance of copper plating processes for IC substrate applications as well as the challenge of reducing costs in the manufacturing process.
Tuesday, January 25
Conformal Coatings: State of the Industry Versus State of the Art
Phil Kinner, Global Technology Director
Wednesday, January 26
Can All Liquid Fluxes Work Well on OSP Pad Finish?
Scott Lewin, Regional Marketing, Assembly Division
Reliability of the Solder Joints: Will Vacuum Soldering Help
Anna Lifton, Sr. R&D Manager
Acid Copper Plating Process for IC Substrate Applications
Sean Fleuriel, R&D Chemist
Thursday, January 27
Bio-Based Encapsulation Resins: Good for The Environment, Good for Your Environment
Beth Turner, Senior Technical Manager
MacDermid Alpha Electronics Solutions will also be exhibiting in Booth 2121 where visitors can learn more about these topics and discover the latest solutions from the Alpha, Kester, MacDermid Enthone, Electrolube, and other brands of MacDermid Alpha.
For additional information, please visit MacDermidAlpha.com.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.