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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Atotech to Participate at IPC APEX EXPO 2022 and Present Four Technical Papers
January 13, 2022 | AtotechEstimated reading time: 1 minute

Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions will take part at IPC APEX EXPO 2022 and present four technical papers this year, touching on the following hot industry topics “crystal structures in plated microvias”, “electroless palladium plating”, “Pd-free activation for electroless Cu”, and “nano structuring photoresist adhesion promoter”. For Atotech’s work on analyzing and improving the crystal structures in plated microvias, our technical paper has been selected as Honorable Mention for the 2022 IPC APEX EXPO Technical Conference. Both, IPC APEX EXPO and its accompanying Technical Conference will be held at the San Diego Convention Center in San Diego, CA from January 22 to 27. The Atotech global team will be at booth 3317 to discuss this year’s technical paper presentations, show highlights or to exchange ideas on new technology demands.
The Atotech technical papers at IPC APEX EXPO Technical Conference 2022:
Session 06: "Microvia design and test 2"
Tuesday, January 25, 2022
Time: 1:30 p.m. to 3:00 p.m.
Topic: Recrystallization and the resulting crystal structures in plated microvias” by Roger Massey
Session 14: "Surface finishes & coatings"
Wednesday, January 26, 2022
Time: 10:00 a.m. to 12:00 p.m.
Topic: “Electroless palladium plating – Correlating plating solution and deposit properties” by Gustavo Ramos
Session 18: "High-density interconnects / Semi-additive processes 2"
Wednesday, January 26, 2022
Time: 1:30 p.m. to 3:00 p.m.
Topic: “Palladium-free activation process for electroless copper deposition” by Roger Massey
Session 30: "High speed PCBs & signal integrity considerations"
Thursday, January 27, 2022
Time: 10:00 a.m. to 11:30 a.m.
Topic: “Nano structuring photoresist adhesion promoter for improved signal integrity in the modern HDI-PCB fabrication” by Christopher Seidemann
Please note, IPC and the state of California have strict COVID-19 protocols in place to protect show attendees. Please visit https://www.ipcapexexpo.org/ for more information and for the Atotech show featured click here: IPC download area - Atotech.
For more information about Atotech or its product offering, please visit www.atotech.com
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06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
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