-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
CyberOptics Unveils New Dual-mode MRS Sensor for Solder Paste Inspection at IPC APEX 2022
January 19, 2022 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will unveil the new Dual-Mode MRS sensor for the SE3000 SPI system in Booth #2541 at the 2022 IPC APEX EXPO, Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will also demonstrate the SQ3000 Multi-Function system for AOI, SPI and CMM and feature the new SQ3000+ Multi-Function system for advanced applications.
The new Dual-Mode MRS sensor for the SE3000 SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high speed inspection and another mode for high resolution inspection. The new sensor is an extension of the proprietary Multi-Reflection Suppression sensor portfolio that provides industry-leading performance in semiconductor and SMT markets. The SE3000 is ideal for measuring height, area, volume, registration and bridging, as well as detecting insufficient paste, excess height, smear, offset and more.
“We designed the Dual-Mode MRS sensor specifically for our SE3000 system to provide both superior performance and versatility for SPI,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “We’re providing yet another solution that can significantly improve our customers’ yields, processes and productivity.”
At APEX, the company will also feature the SQ3000™+ Multi-Function system for inspection and metrology, an extension of the multi-award-winning SQ3000 platform deemed best-in-class, that not only conducts AOI and SPI, but uniquely delivers in-line, full coordinate measurement (CMM) data in seconds, not hours. The all-in-one system offers a combination of unmatched high accuracy and high speed, with an even higher resolution MRS sensor that inhibits reflection-based distortions caused by shiny components and surfaces.
The SQ3000+ is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT for medical, military, aerospace and advanced electronics, 008004/0201 SPI, socket metrology and other challenging CMM applications.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.