-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Hon Hai, Gogoro, IBC, Indika to Jointly Develop Sustainable New Energy Ecosystem Project in Indonesia
January 24, 2022 | Hon Hai Technology GroupEstimated reading time: 2 minutes

Hon Hai Technology Group (Foxconn), a global leader in smart manufacturing, has signed a Memorandum of Understanding (MoU) with the Indonesian Ministry of Investment/BKPM, IBC, Indika, and Gogoro to jointly develop a sustainable new energy ecosystem in Indonesia that focuses on electric battery, electric mobility, and associated industries.
Presided over by Mr. Bahlil Lahadalia, Minister of Investment/ Chairman of BKPM, and witnessed by Mr. Erick Thohir, Minister of State-Owned Enterprises (BUMN), the virtual MoU signing ceremony was attended by Mr. Young Liu, Chairman of Hon Hai Technology Group (Foxconn); Mr. Horace Luke, CEO of Gogoro Taiwan Limited; Mr. Toto Nugroho, President Director of PT. Industri Baterai Indonesia (IBC); and Mr. Azis Armand, Vice President of PT. Indika Energy Tbk., (Indika).
Under the MoU, Hon Hai together with Gogoro, IBC and Indika will explore a wide scope of investment and enter a mutually beneficial cooperation in setting up the new energy ecosystem in Indonesia, ranging from electric battery manufacturing that includes battery cell, battery module and battery pack, to the development of 4-wheel and 2-wheel EV ecosystem. The cooperation will also include the development of EV supporting industries such as energy storage systems (ESS), battery exchange stations and battery recycling. In the initial phase, the development of New Energy and Full Battery Platform Production in Indonesia—producing LFP or Nickel (solid state) premium quality EV batteries—will be the priority.
“I am pleased with the investment plan of Hon Hai and Gogoro to Indonesia together with local partners. Their involvement does not only bring in capital, but also share with us their technology and experience, creating a modern and open new EV ecosystem. It will also provide huge opportunities for local talents and local startups to develop and participate in the national EV ecosystem in Indonesia and path the way for a smarter and more sustainable future,” said Mr. Bahlil Lahadalia, Minister of Investment.
“Hon Hai is excited to embark on the journey to transform the new energy ecosystem in Indonesia in cooperation with the local government, Gogoro, IBC and Indika. I believe the implementation of MIH platform, alongside our Build-Operate-Localize (BOL) strategy and manufacturing expertise will allow us to meet the market demand and create a sustainable new EV ecosystem in Indonesia” said Mr. Young Liu, Chairman of Hon Hai Technology Group.
Leveraging its open “MIH platform”, Hon Hai will enable cooperation and knowledge sharing between local Indonesian companies and global business players, creating sustainable new energy ecosystem in Indonesia. This is another government level cooperation of Hon Hai following the establishment of BOL growth strategy with PTT of Thailand last year.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.