Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

L3Harris Receives Contract to Develop Next-Generation Security Processor for US Government

06/02/2025 | L3Harris Technologies
L3Harris Technologies has been awarded a contract by the U.S. government to develop a next-generation security processor to secure communication devices across the globe.

2025 COMPUTEX Compal Unveils 'The Race is On' Strategy During Forum Session

05/23/2025 | Compal Electronics Inc.
As AI models and computing density continue to grow at an exponential rate, the data center industry is entering a new era where cooling capacity has become the next competitive threshold.

Foxconn, NVIDIA to Build AI Factory; Becomes Taiwan’s First NVIDIA Cloud Partner to Power Three Strategic Platforms

05/19/2025 | Foxconn
Hon Hai Technology Group (Foxconn) announced that it is partnering with NVIDIA and to build a state-of-the-art AI Factory supercomputing center in Taiwan.

Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity

05/14/2025 | BUSINESS WIRE
Corning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.

Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems

05/08/2025 | Cadence Design Systems
At its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved. Log in