The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
Indium Expands Fine Wire Capabilities
January 26, 2022 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004” (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.
This new offering is designed to provide a fine wire solution to customers dealing with increased solder joint density and miniaturization in applications where solder paste reflow and other soldering approaches are not effective, such as robotic soldering for fine-pitch attachment of small components to medical devices or fine-pitch PCB assemblies. Hand soldering and rework with this new fine diameter wire may be possible for very skilled operators.
Fluxes recommended for this new fine diameter are Indium Corporation’s Core 230-RC, an award-winning low spatter wire that exhibits excellent performance in robotic soldering applications, and CW-807, a flux-cored wire formulated for general purpose electronics soldering with a clear residue.
The fine diameter wire is available in the following alloys*:
- SAC305
- SAC387
- Sn96.5Ag3.5
- Sn96.3Ag3.7
- Sn96Ag4
*Other Pb-free alloy options can be discussed.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.