Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Mek Successfully Delivers THT Automatic Optical Inspection Equipment for Yunex Traffic
January 27, 2022 | Mek (Marantz Electronics)Estimated reading time: 1 minute
Mek (Marantz Electronics) has successfully delivered two desktop automatic optical inspection systems for Yunex Traffic, a global leader in designing, manufacturing and installing intelligent traffic systems.
The PowerSpector GDAz systems, which now integrate into Yunex Traffic’s manufacturing facility and support the inspection of THT and solder joints, are the most versatile AOI inspection systems, reliably inspecting SMT and THT component bodies for a variety of components including presence/absence, type, polarity, offset, text and colours. Suitable for use in pre-reflow, post-reflow, post-wave and post-selective soldering, they can also be used for 2D solder paste inspection and first article inspection.
Henk Biemans, Mek’s CEO explained: “Our high-performing AOI systems have the capability to do both topside through hole components and solder inspection which means we were able to provide an all in one solution for Yunex Traffic. We were delighted to meet all of Yunex Traffic’ specific requirements and it is great to see the equipment in use and making a difference to the manufacture of traffic equipment that’s installed all over the world.
Simon Martin, Head of Global Manufacturing for Yunex Traffic commented: “The introduction of the automatic optical inspection systems is making a real difference to how we manufacture key components for a wide range of traffic systems. We’re a global leader in intelligent traffic systems and this technology is enabling us to continue manufacturing critical components to the highest quality and deliver industry-leading solutions for our customers and the industry.”
The PowerSpector GDAz series targets inspection of taller THT components with a top clearance of 60mm and side cameras with a larger Field of View and 20µm resolution. A larger 3 angle lighting system secures optimal meniscus profiling in combination with increased top clearance without foregoing the maximum inspection area. A z-axis camera enables the inspection of a large variety of boards which vary in height. Due to the software’s abundance of features/test types, false failures can be eliminated easily.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.