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IPC Announces New Board Members at IPC APEX EXPO 2022
January 27, 2022 | IPCEstimated reading time: Less than a minute
At the 65th IPC Annual Meeting on January 25, held in conjunction with IPC APEX EXPO 2022, the IPC Board of Directors announced new officers and members. Board officers serve a two-year term; board members serve a four-year term, and student board member serves a one-year term.
The newly elected Board officers are:
- IPC Board Chair: Bob Neves, chairman and CTO, Microtek Laboratories
- IPC Board Vice Chair: Tom Edman, president and CEO, TTM Technologies
- IPC Board Secretary/Treasurer: Jeff Timms, CEO and General Manager, ASM Assembly Solutions of America
The newly elected Board members are:
- First-term Board Member: Lisa Weeks, Senior Vice President, Chief Strategy Officer, and Head of Investor Relations, Benchmark Electronics
- First-term Board Member: Joe DeMan, Senior Board Executive, Amphenol – CTI
- Second-term Board Member: Jay Hill, Chief Technology Officer, Molecular Imaging and Computed Tomography, GE Healthcare
- Student Board Member: Hannah Nelson, Valparaiso University
"IPC is privileged to add these outstanding professionals to our current slate of Board members, said John W. Mitchell, IPC president and CEO. “We look forward to working with them as we advance the global electronics manufacturing industry and build electronics better.”
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.