Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Koh Young Reinforces its Global Smart Factory Focus by Promoting Ivan Aduna to Global MES Leader
February 1, 2022 | Koh Young TechnologyEstimated reading time: 2 minutes
Following a successful return to live trade shows at IPC APEX Expo in San Diego, Koh Young, the leading 3D measurement-based inspection equipment and solutions provider for the electronics industry, announces it has reinforced its dedication to helping customers create a smart factory by promoting Ivan Aduna to Global MES Leader. In this expanded role, Ivan will develop and manage MES (Manufacturing Execution Systems) software and application deployments on a global level for Koh Young.
“Ivan’s promotion to Global MES Leader is just another example of the steps we are taking steps to ensure our customers are supported on their journey to create a smart factory,” said Joel Scutchfield, General Manager of SMT Operations at Koh Young America. “We [Koh Young] have been dedicated to making our customer’s lives easier. From new award-winning machines to AI-powered software tools, we are driven to improve the lives of our customers.”
Ivan Aduna earned his Mechatronics Engineering degree at the Universidad Panamericana in Guadalajara where he focused on embedded systems, algorithms, and low-power solutions. From there, Ivan applied his software expertise at Intel where he designed and executed test plans and use cases to refine network controllers on both Windows and Linux environments. His start with the Internet of Things began at Dextra Technologies where he developed embedded software systems for the automotive segment and telemetry-based tracking solutions. Today, Ivan leads the global smart factory integration efforts for Koh Young.
“When I combine my knowledge with my experience from positions as a manufacturer and a supplier it helps me understand, adopt, and implement MES solutions that open the gates of a smart factory to everyone,” commented Ivan Aduna about his new role. “I am excited to expand my role to help our customers around the world improve their manufacturing environment.”
If you missed the IPC APEX Expo or want to learn more about using our smart factory solutions to boost your productivity, visit us at kohyoungamerica.com or follow us at linkedin.com/company/koh-young-technology-inc.
# # #
Check out this additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal (a free eBook available for download)
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e Book library here
About Koh Young Technology, Inc.
Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative solutions for challenges with machined parts, dispensed materials, and semiconductor packages. Through its innovations, Koh Young has thousands of global customers, and has the largest global SPI and AOI market share. By adopting a user-centric R&D focus, it adapts its core competencies to develop innovative solutions for new and existing markets. From the corporate headquarters in Korea to its global sales and support offices in Europe, Asia, and the Americas, Koh Young ensures close contact with the market, and more importantly, its growing customer base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at kohyoung.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.