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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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Mek Adds New Distributor in India
February 2, 2022 | Mek (Marantz Electronics)Estimated reading time: 1 minute
Mek (Marantz Electronics), a leading provider of Automatic Optical Inspection solutions, has recently expanded its global distribution and service network with the addition of Indian company, ACD Renaissance LLP.
The Pune based enterprise has taken over sales and service for Mek’s Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) systems in India.
Electronics manufacturing in India is going through a period of rapid growth with more and more global players announcing plans to manufacture there, as well as many new, local companies starting in the electronics arena.
ACD Renaissance was founded in 2017 and is an end to end solutions provider for PCB assembly processes, SMT equipment, Through hole assembly equipment, sales and service support. At their core is a desire to share their knowledge and experience with customers by supporting process optimization and yield improvements.
“Mek is excited to expand its presence in the region by working with ACD Renaissance. They are well respected by customers and have demonstrated ability to grow markets for electronics manufacturing equipment,” said Henk Biemans, CEO of Mek.
“We are very excited to be working with Mek.” stated Manohar Singh of ACD Renaissance. “India is certainly one of the most important markets for the Electronics manufacturing/ Semicon / APAS sectors and we see huge potential in the country from markets such as EMS, Automotive, Electric Vehicles, Consumer Electronics, Medical, Telecoms and Defence & Aerospace. Mek’s AOI and SPI equipment is an important addition to our current product range.”
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Julia McCaffrey - NCAB GroupSuggested Items
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.