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We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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Real Time with... IPC APEX EXPO 2022: Smart Factories Demand Total Inspection
February 8, 2022 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Joel Scutchfield of Koh Young America and SMT007 Editor Nolon Johnson discuss the smart factory's need for a total inspection solution that includes SPI, AOI, DPI, API, and KSMART, along with multi-point inspection (SPI, pre, and post) to improve yields. As Scutchfield points out, "Connectivity alone does not equal a smart factory. It's what you do with the data."
If you were unable to attend IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
Watch this interview below or click here to view on our show page.
Check out this additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal (a free eBook available for download)
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e Book library here
Suggested Items
The Test Connection, Inc. to Showcase Advanced Testing Solutions at SMTA Austin Expo & Tech Forum
02/04/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce its participation in the SMTA Austin Expo & Tech Forum on February 6, 2025 in Austin, Texas.
Nolan's Notes: Find the Help You Need—Accessing Technical Resources
02/04/2025 | Nolan Johnson -- Column: Nolan's NotesSome close friends of mine have a card catalog in their family room—with the cards still in it. It’s just a novelty now, but it wasn’t that long ago that the card catalog was the end-all, be-all of research resources. As a college student, I remember something like two dozen or more of the very large card catalog cabinets in the Oregon State University Library. It’s not lost on me that my friend’s card catalog “liberated” from the university is a snapshot of that particular knowledge base at that particular moment in time. Today’s access to a library’s contents have changed dramatically.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
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The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs
01/24/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce the launch of its newest venture, The Training Connection, LLC, a company dedicated to addressing the growing need for practical and effective training in test engineering and development. With a focus on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection is poised to empower professionals with the tools and expertise they need to excel.