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Insulectro Appoints Industry Veterans Joan Vrtis and Jeff Doubrava to Advisory Board
February 8, 2022 | InsulectroEstimated reading time: 2 minutes
Insulectro, the largest distributor of materials for use in the printed circuit board and printed electronics industries, has announced the appointment of Joan Vrtis and Jeff Doubrava to its advisory board.
Joan K. Vrtis PhD has held several circuit technology positions in her long successful career. In the 1990s, working for Intel Corp., she developed substrate and polymer solutions for the Pentium product line. Upon leaving Intel, Dr. Vrtis and a business partner acquired FlipChip International, a leading WLP/CSP technology company based in Phoenix, AZ. She held the CTO position until divesting her stake in late 2008. After working with start-ups for several years as CTO (Kemeta) and COO (Shocking Technology), she joined Multek, Ltd, developing their San Jose, CA & Zhuhai China Interconnect Technology Centers. She held the role of CTO until 2018 and transferred to Flex, Ltd as SVP of Innovation & Technology Integration until she retired mid-2019.
Dr. Vrtis holds several patents in materials, circuit structures and process. She has been a speaker at various conferences and participated on several technology panels promoting advanced circuit technology and its applications. She holds a PhD & MS Polymer Science & Engineering (Univ. of Massachusetts Amherst), Masters in Metallurgy & Materials (Illinois Institute of Technology), B.S. Chemistry (Univ. of Illinois, Chicago) and an MBA (DePaul University). She is an avid outdoors person and enjoys traveling the world to visit family and friends.
Also appointed to the Insulectro Advisory Board is Jeff Doubrava. Doubrava’s career has been focused on the electronics industry, developing materials that enable production of advanced components and driving the growth of the key electronic materials suppliers. As Managing Partner of Prismark, Jeff led the company’s electronic materials practice helping to enable the growth of client companies across the world by means of share gain, entry into new markets or major acquisitions. Prior to joining Prismark, Jeff spent twenty years with Shipley in an array of technology, business and sales roles, most recently as the Global Business Director of its PCB Materials business where he was involved in a series of transformational acquisitions.
Jeff holds a BA in Chemistry from the University of Rochester and an MBA from Babson College. He holds several US patents for his development of enabling electronic materials. Jeff and his family live in south coastal Massachusetts, where he is a sailor and part-time boat builder as well as an active member of town government and land conservation groups.
“Insulectro is honored to welcome these two highly accomplished individuals to the Insulectro family. For many years, Joan and Jeff have helped shape the industry with their leadership, insight, and professional accomplishments, especially with the impressive array of patents each has developed,” remarked Insulectro President and CEO, Patrick Redfern. “Jeff and Joan join fellow Board Members John Odom, and Randy Friedman. We are fortunate to have such a powerhouse team of advisors, unrivalled in the industry.”
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A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.