Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Powering the Future: From Substrate to System—The Power Module Assembly

08/19/2026 | Brian Buyea -- Column: Powering the Future
If you ask 10 engineers what “assembly” means in electronics, you’ll likely get 10 variations of the same answer: placing components on a board and soldering them down. That definition might work for traditional PCB-based electronics, but in high-power, high-reliability systems, it falls short by a mile.

Rice to Lead $15M Army Research Center for Next-Generation Sensing and Communications

08/05/2026 | Rice University
Rice University has received a $15 million award from the U.S. Army Research Office to establish a five-year research center dedicated to advancing secure sensing, imaging and communications.

Federal Electronics Expands Advanced Manufacturing for Military and Aerospace Cable and Wire Harness Programs

07/22/2026 | Federal Electronics
Federal Electronics, a leading provider of high-reliability electronic manufacturing services (EMS), has expanded its cable assembly and wire harness manufacturing capabilities and production capacity to support the growing needs of military, defense, and aerospace OEMs.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Remtec Announces the Industry's Most Complete Suite of Plating Capabilities Including PCTF Technology for Advanced Electronic Packaging

07/07/2026 | Remtec
Remtec, a leader in advanced metallized ceramic substrates and electronic packaging solutions, is proud to announce the availability of what is believed to be the industry's most comprehensive portfolio of plating surface finish technologies for thick film ceramic circuits and advanced electronic assemblies.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in