-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Design Competition Winner Announced at IPC APEX EXPO 2022
February 10, 2022 | IPCEstimated reading time: 1 minute
The inaugural IPC Design Competition at IPC APEX EXPO 2022 resulted in a win for Rafal Przeslawski, Xilinx, whose printed circuit board design earned him the top prize.
In late 2021, printed board design engineers from around the world were invited to compete in IPC’s inaugural PCB Design Competition. Intended to be accessible for anyone with a design tool and an internet connection, this new competition would challenge designers in two heats: an at-home, 30-day full board build, and an ‘in-person’ four-hour routing challenge at IPC APEX EXPO 2022.
In the preliminary heat, 14 designers from all corners of the globe – from India to the Netherlands; Oregon to the United Kingdom – were provided with a schematic, a component BOM, and scope of work document, and were asked to design a board that was compliant with IPC’s various board design standards. The given schematic was representative of a motor control board that included features intended to test the competitors’ understanding of various design methodologies.
Out of 14 preliminary competitors, three finalists were chosen to compete at the finals: Elliot Wakefield, a hobbyist based in the United States, Nick Wallis, an electronics engineer at Tribosonics in the United Kingdom, and Rafal Przeslawski, a hardware development engineer at Xilinx based in Germany.
The finals heat took place at IPC APEX EXPO 2022. The competitors were challenged to complete the design of a nearly complete board – missing only design rules, routing, and a few components left in the margins. “With only four hours to do so, completing the board was a careful balance of thoughtful component placement optimization and design rule definition, and brass-tacks routing,” explained Patrick Crawford, manager, design standards and related industry programs. “The board design was that of a functional, programmable blinky-badge that was actually fabricated and on display at IPC APEX EXPO. In other words, unlike the preliminary heat, the final design was representative of a real-world, functional application.”
At the end of the four hours, each competitor delivered their project file to the judges, who deliberated for two hours, ultimately crowning Rafal Przeslawski as the IPC Design Competition 2022 champion.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Peters, Starteam, and Würth Elektronik Team Up For Digital Coating Technology
10/23/2025 | PetersUnder this heading, the PCB manufacturers Starteam and Würth Elektronik, along with Peters as inkjet coating supplier, have taken the initiative and worked together for months in trusting and target-oriented cooperation, to promote this innovative digital coating technology for solder resists and establish it on the market.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Zuken Announces ZIW Americas 2026 in Dallas
10/21/2025 | ZukenZuken USA, Inc., a global leader in electrical and electronic design automation, announced Zuken Innovation World (ZIW) Americas 2026, the company’s premier global conference dedicated to advancing the future of electrical and electronic product design. ZIW 2026 will be held June 9-11 in Dallas, Texas.
Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist
10/17/2025 | Keysight Technologies, Inc.Keysight Technologies, Inc., announced the completion of its acquisitions of the Optical Solutions Group from Synopsys, Inc., and PowerArtist from Ansys, Inc.