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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Design Competition Winner Announced at IPC APEX EXPO 2022
February 10, 2022 | IPCEstimated reading time: 1 minute
The inaugural IPC Design Competition at IPC APEX EXPO 2022 resulted in a win for Rafal Przeslawski, Xilinx, whose printed circuit board design earned him the top prize.
In late 2021, printed board design engineers from around the world were invited to compete in IPC’s inaugural PCB Design Competition. Intended to be accessible for anyone with a design tool and an internet connection, this new competition would challenge designers in two heats: an at-home, 30-day full board build, and an ‘in-person’ four-hour routing challenge at IPC APEX EXPO 2022.
In the preliminary heat, 14 designers from all corners of the globe – from India to the Netherlands; Oregon to the United Kingdom – were provided with a schematic, a component BOM, and scope of work document, and were asked to design a board that was compliant with IPC’s various board design standards. The given schematic was representative of a motor control board that included features intended to test the competitors’ understanding of various design methodologies.
Out of 14 preliminary competitors, three finalists were chosen to compete at the finals: Elliot Wakefield, a hobbyist based in the United States, Nick Wallis, an electronics engineer at Tribosonics in the United Kingdom, and Rafal Przeslawski, a hardware development engineer at Xilinx based in Germany.
The finals heat took place at IPC APEX EXPO 2022. The competitors were challenged to complete the design of a nearly complete board – missing only design rules, routing, and a few components left in the margins. “With only four hours to do so, completing the board was a careful balance of thoughtful component placement optimization and design rule definition, and brass-tacks routing,” explained Patrick Crawford, manager, design standards and related industry programs. “The board design was that of a functional, programmable blinky-badge that was actually fabricated and on display at IPC APEX EXPO. In other words, unlike the preliminary heat, the final design was representative of a real-world, functional application.”
At the end of the four hours, each competitor delivered their project file to the judges, who deliberated for two hours, ultimately crowning Rafal Przeslawski as the IPC Design Competition 2022 champion.
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SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?