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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Zuken Announces ZIW Americas 2026 in Dallas
October 21, 2025 | ZukenEstimated reading time: 2 minutes
Zuken USA, Inc., a global leader in electrical and electronic design automation, announced Zuken Innovation World (ZIW) Americas 2026, the company’s premier global conference dedicated to advancing the future of electrical and electronic product design. ZIW 2026 will be held June 9-11 in Dallas, Texas.
Building on decades of innovation, ZIW 2026 will bring together engineers, industry leaders, Zuken experts and technology partners to explore the latest advancements in digital engineering, AI-assisted design automation and model-based product development. Participants will have opportunities to exchange ideas, share best practices and preview Zuken’s technology roadmap
The conference will offer a robust agenda of customer success stories, partner presentations and in-depth technical sessions covering the entire spectrum of electrical and electronic design, from conceptual systems engineering to manufacturing execution.
“Very informative with great information shared—and a strong opportunity to learn from teams leading digital transformation,” said Sage Pasternacki-Padilla of Northrop Grumman.
Attendees will gain firsthand insight into innovations across Zuken’s product portfolio, including:
- CR-8000, for advanced PCB and system design
- E3.series, for wire harness and electrical system design
- DS-2, for enterprise design data management
- GENESYS, for model-based systems engineering
The event will also spotlight Zuken’s AI-assisted technologies that are driving next-generation PCB place and route and connected engineering workflows that enable digital transformation across industries.
While at the event, attendees can take advantage of additional educational, collaborative, and career-focused activities: free, E3.series 2026 update training and multiple on-site E3.series certification exams; all on June 9.
“Zuken Innovation World has always been more than a conference. It’s a catalyst for collaboration and inspiration across the engineering community,” said Kent McLeroth, president and CEO of Zuken USA, Inc. “ZIW 2026 will showcase how digital engineering and AI-assisted design are reshaping the way products are conceived, designed and brought to market. We look forward to connecting with our customers and partners in Dallas.”
“Attendees can leave Dallas with tangible wins—free, hands-on E3.series training to sharpen skills and on-site product certification to validate,” said Bob Potock, vice president of marketing. “Pair that with real customer case studies and direct access to Zuken experts, and teams will take home workflows they can apply on day one.”
As Zuken celebrates over five decades of innovation, ZIW 2026 will reaffirm the company’s commitment to delivering powerful design solutions that connect the digital and physical worlds.
ZIW Americas 2026 will be held June 9-11, 2026, in Dallas, Texas. Registration is open on the event site; details on partner and sponsorship opportunities will be available soon.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
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ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
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