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Ucamco to Release UcamX v2021.12 and Integr8tor v2021.12
February 14, 2022 | UcamcoEstimated reading time: Less than a minute

Ucamco is proud to release UcamX v2021.12 and Integr8tor v2021.12. These new versions of our CAM and Pre-CAM software include dozens of additions, new options, fixes and general improvements to increase our customers’s productivity.
UcamX v2021.12
- YELO Copper Adjuster extensions
- YELO Legend Adjuster extensions
- YELO Mask Adjuster extensions
- DXF Input extensions
- Rout Manager optimizations
- Transform Object extensions
- Inkjet Output, new option
- ODB++ Output extensions
Integr8tor v2021.12
- Outline handling extensions
- QED report extensions
- Cockpit extensions
- DRC capabilities in UcamX WE extensions
- Net compare refinements
- ODB++ Output extensions
- Automatic layer stack-up enhancements
- Security and performance upgrades
UcamX and Integr8tor v2021.12 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract, are welcome to contact their local sales channel.
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Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.