Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

TÜV Rheinland Advances Electronics Supply Chain Traceability

01/13/2026 | BUSINESS WIRE
With electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink

12/29/2025 | Elephantech
Japanese deep-tech Elephantech announced successful development of an innovative process to form High-Density Interconnect (HDI) microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”

TopLine Introduces Cost-Efficient Flip Chips with Daisy Chain for Electrical Test Learning

12/23/2025 | TopLine Corporation
Flip Chips with Daisy Chain from TopLine Corporation are a cost-efficient way to learn electrical test for engineers seeking to understand and practice necessary techniques for working with Flip Chip components.

Elephantech Launches Copper-on-Copper Self-Assembled Nanoparticles

12/22/2025 | Elephantech
Japanese deep-tech startup Elephantech Inc. announced the successful development of Self-Assembled Copper Nanoparticles (SA-CuNP), a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.

Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging

12/24/2025 | Matt Stevenson -- Column: Connect the Dots
If you read my column regularly, you know I’m passionate about helping designers get the most from their designs. In my November column, I focused on designer best practices for the electroless copper component of the manufacturing process. The next step is outer layer imaging: the transition from digital to physical, and where the designer’s IP meets the board.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in