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Ucamco to Release UcamX v2021.12 and Integr8tor v2021.12
February 14, 2022 | UcamcoEstimated reading time: Less than a minute
Ucamco is proud to release UcamX v2021.12 and Integr8tor v2021.12. These new versions of our CAM and Pre-CAM software include dozens of additions, new options, fixes and general improvements to increase our customers’s productivity.
UcamX v2021.12
- YELO Copper Adjuster extensions
- YELO Legend Adjuster extensions
- YELO Mask Adjuster extensions
- DXF Input extensions
- Rout Manager optimizations
- Transform Object extensions
- Inkjet Output, new option
- ODB++ Output extensions
Integr8tor v2021.12
- Outline handling extensions
- QED report extensions
- Cockpit extensions
- DRC capabilities in UcamX WE extensions
- Net compare refinements
- ODB++ Output extensions
- Automatic layer stack-up enhancements
- Security and performance upgrades
UcamX and Integr8tor v2021.12 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract, are welcome to contact their local sales channel.
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Sweeney Ng - CEE PCBSuggested Items
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Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
12/29/2025 | ElephantechJapanese deep-tech Elephantech announced successful development of an innovative process to form High-Density Interconnect (HDI) microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”
TopLine Introduces Cost-Efficient Flip Chips with Daisy Chain for Electrical Test Learning
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Elephantech Launches Copper-on-Copper Self-Assembled Nanoparticles
12/22/2025 | ElephantechJapanese deep-tech startup Elephantech Inc. announced the successful development of Self-Assembled Copper Nanoparticles (SA-CuNP), a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.
Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging
12/24/2025 | Matt Stevenson -- Column: Connect the DotsIf you read my column regularly, you know I’m passionate about helping designers get the most from their designs. In my November column, I focused on designer best practices for the electroless copper component of the manufacturing process. The next step is outer layer imaging: the transition from digital to physical, and where the designer’s IP meets the board.