-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Nano Dimension’s Board of Directors Welcomes Igal Rotem
February 15, 2022 | Nano Dimension Ltd.Estimated reading time: 2 minutes
Nano Dimension Ltd, an industry leader in Printing Technologies, Additively Manufactured Electronics (AME), Printed Electronics (PE), and Micro Additive Manufacturing (Micro-AM) announced the appointment of Mr. Igal Rotem to the Board of Directors of the Company (the “Board”), effective immediately. Mr. Rotem will replace Dr. Eli David, who resigned from the Board, but will continue to serve as the Chief Technology Officer of the Company, leading the Company’s Artificial Intelligence, Deep Learning and Machine Learning technologies.
Since 2010, Mr. Rotem has served as the Chairman and later as the Chief Executive Officer of Finaro Bank (formerly known as Credorax), a principal member of Visa and MasterCard Europe, and a licensed bank. Finaro offers a unified digital automated and interactive Acquiring and Payment Processing solution to E-commerce and M-commerce merchants and Payment Service Providers (PSPs). Over the past few years, as a CEO, Mr. Rotem has led the company to profitability and steady growth of 40% year-over-year, making Finaro one of the fastest-growing members of Visa and MasterCard in the world.
Mr. Rotem is also the former Founder and Chief Executive Officer of PowerDsine, which invented and sold Power over Ethernet (PoE) technology chipsets and solutions. Mr. Rotem increased PowerDsine’s international customer base, including HP Inc., 3Com Corporation, CISCO Systems (Nasdaq: CSCO), and others. He then initiated and executed the initial public offering of PowerDsine on Nasdaq and the acquisition of PowerDsine three years later by Microsemi Corporation (Nasdaq: MSCC).
Mr. Rotem was also the General Manager of Butterfly Communication, which was the leader in developing short-distance wireless communication which later became known as Bluetooth technology. The company was one of the world’s pioneers in providing Bluetooth semiconductors solutions to early market adopters and was acquired by Texas Instruments.
Mr. Rotem has an MBA in Technology Management, Industrial Management Marketing and Finance from Tel Aviv University, and a B.Sc. in Electrical Engineering from Tel Aviv University. He was awarded the Ernst & Young 2004 Entrepreneur of the Year.
Mr. Yoav Stern, Nano Dimension’s Chairman and Chief Executive Officer, commented, “Igal is a unique entrepreneur with a multi-disciplinary background, spanning from advanced electronics technologies to fintec and transactional software and hardware. He is a highly experienced executive and serial entrepreneur with extensive business development, sales management, and strategic business planning skills. He successfully spearheaded companies through entire lifecycle stages: start-up, accelerated growth, turnaround, initial public offering on Nasdaq, joint venture, and M&A. Igal is who we need to enhance Nano Dimension’s Board knowledge and support for our unique development pattern. I am convinced that Igal will add substantial value to our board and our management.”
Mr. Stern added, “We thank Dr. Eli David for his tenure on our Board. Eli is continuing with his important work in the Company, leading the highly intensive projects of implementing Artificial Intelligence, Deep Learning and Machine Learning technologies into our various 3D-Printing Systems to improve yield and throughput as we advance toward machines for manufacturing of 3D parts.”
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.