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Indium to Present at IMAPS Device Packaging Conference
February 15, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Evan Griffith, product specialist, will share his technical knowledge and insight on the evolution of solder paste for semiconductor applications at the International Microelectronics Assembly & Packaging Society (IMAPS) 18th International Conference and Exhibition on Device Packaging at 10:30 a.m. local time, Thursday, March 10 in Fountain Hills, Arizona, U.S.
Advanced packaging techniques continue to evolve within the semiconductor industry. Within advanced packaging, heterogeneous integration has become a solution for those wishing to integrate distinct and complex dies into smaller packages. Many application trends are emerging to meet the challenges of heterogeneous integration which are causing the assembly process to become more intricate, with these trends requiring soldering material technology, especially that of solder flux, to be up to date and cutting edge. In Solder Flux Evolution for Heterogeneous Integration, Griffith will discuss the evolution of solder fluxes for heterogeneous integration, including novel advancements in fluxes for flip-chip assembly, BGA ball-attach assembly, and assemblies which have advanced to necessitate fluxless component attach.
Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste® materials. He is based at Indium Corporation’s global headquarters. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customer inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. Griffith earned his bachelor’s of engineering degree in materials science, graduating with honors, and his master’s of engineering management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.
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