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Rogers Increasing Capacity to Meet Growing Demands for Power Module Substrates
February 16, 2022 | Rogers CorporationEstimated reading time: 1 minute

Rogers Corporation’s Advanced Electronics Solutions (AES) announced a further multi-million Euro investment into its site in Eschenbach, Germany, to add to the expansion plans first announced in August 2021. This additional investment will increase capacity of curamik® AMB (Active Metal Brazed) and DBC (Direct Bonded Copper) substrates and allow Rogers to meet the growing demand in the automotive, renewable energy and industrial market segments. The first phase of the expansion is slated for completion in the second half of 2022, with ongoing increases coming on line throughout 2023.
“This investment is a clear demonstration of our commitment to meet the increasing performance and volume requirements of our global customers”, said Roger Tushingham – VP and GM of curamik®. “For many years our teams have done an exceptional job of providing our customers with innovative power substrate solutions that they can rely on. This expansion in capacity will help us meet the expectations of our loyal existing customers, in addition to allowing us to service the ever-expanding customer base in the markets that we serve.”
This is the latest in a series of investments totaling tens of millions of Euro in the production capacity and capability at the Eschenbach location. Whereas earlier investments have been focused on advanced AMB capability, this current investment round will increase the capability and capacity across the entire curamik portfolio.
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Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
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