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ATS’ CPU Cooler for Dense PCBs Pulls in Air from Four Directions
February 17, 2022 | Advanced Thermal Solutions, Inc.Estimated reading time: 1 minute

Advanced Thermal Solutions, Inc. (ATS) is now providing quadFLOW active CPU coolers, designed to cool high powered chips in densely filled locations. quadFLOW active coolers pull air from four directions to maximize thermal performance where airflow is limited, and conventional cooling solutions are ineffective.
Many 1U and 2U servers have constrained internal airflow. This can make cooling today's highest-performing Intel, AMD and Nvidia chips difficult. If a cooling system can’t effectively manage chip heat, a processor may reduce its speed for safety, which can compromise computer performance. ATS quadFLOW coolers, drawing cooling air from four directions, are ideal for cooling such 1U and 2U systems and capable of handling a max TDP of 160W. Cooling performance is 20% higher than other coolers.
Provided standard with PEM attachment hardware, quadFLOW coolers are designed to precisely fit the ILM (Independent Loading Mechanism) retention device on Intel LGA 2011 (Socket R) and newer LGA 2066 (Socket R4) CPU sockets. The PEMs align with the mounting hole patterns in the LGA 2011 and LGA 2066 square ILM (80 x 80 MM) CPU sockets. An ATS backing plate allows quadFLOW’s use with AMD, Nvidia and other non-intel CPUs.
The blowers on quadFLOW active CPU coolers have a PWM (pulse width modulation): 10.8 VDC ~ 13.2 VDC operating voltage, with an MTBF of 598,000 hours measured at 40oC. When weight is an issue, choose quadFLOW coolers with aluminum fins. For higher performance, copper fins are available. When higher cooling levels are needed, quadFLOW coolers can be paired with a vapor chamber base.
quadFLOW coolers come with pre-attached Parker Chomerics high performance (3.0 W/m-k thermal conductivity) T670 thermal grease. T670 supports high power applications requiring minimum bond line thickness.
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Klaus Koziol - atgSuggested Items
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07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.