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ATS’ CPU Cooler for Dense PCBs Pulls in Air from Four Directions
February 17, 2022 | Advanced Thermal Solutions, Inc.Estimated reading time: 1 minute
Advanced Thermal Solutions, Inc. (ATS) is now providing quadFLOW active CPU coolers, designed to cool high powered chips in densely filled locations. quadFLOW active coolers pull air from four directions to maximize thermal performance where airflow is limited, and conventional cooling solutions are ineffective.
Many 1U and 2U servers have constrained internal airflow. This can make cooling today's highest-performing Intel, AMD and Nvidia chips difficult. If a cooling system can’t effectively manage chip heat, a processor may reduce its speed for safety, which can compromise computer performance. ATS quadFLOW coolers, drawing cooling air from four directions, are ideal for cooling such 1U and 2U systems and capable of handling a max TDP of 160W. Cooling performance is 20% higher than other coolers.
Provided standard with PEM attachment hardware, quadFLOW coolers are designed to precisely fit the ILM (Independent Loading Mechanism) retention device on Intel LGA 2011 (Socket R) and newer LGA 2066 (Socket R4) CPU sockets. The PEMs align with the mounting hole patterns in the LGA 2011 and LGA 2066 square ILM (80 x 80 MM) CPU sockets. An ATS backing plate allows quadFLOW’s use with AMD, Nvidia and other non-intel CPUs.
The blowers on quadFLOW active CPU coolers have a PWM (pulse width modulation): 10.8 VDC ~ 13.2 VDC operating voltage, with an MTBF of 598,000 hours measured at 40oC. When weight is an issue, choose quadFLOW coolers with aluminum fins. For higher performance, copper fins are available. When higher cooling levels are needed, quadFLOW coolers can be paired with a vapor chamber base.
quadFLOW coolers come with pre-attached Parker Chomerics high performance (3.0 W/m-k thermal conductivity) T670 thermal grease. T670 supports high power applications requiring minimum bond line thickness.
Suggested Items
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
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ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
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Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.