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ATS’ CPU Cooler for Dense PCBs Pulls in Air from Four Directions
February 17, 2022 | Advanced Thermal Solutions, Inc.Estimated reading time: 1 minute
Advanced Thermal Solutions, Inc. (ATS) is now providing quadFLOW active CPU coolers, designed to cool high powered chips in densely filled locations. quadFLOW active coolers pull air from four directions to maximize thermal performance where airflow is limited, and conventional cooling solutions are ineffective.
Many 1U and 2U servers have constrained internal airflow. This can make cooling today's highest-performing Intel, AMD and Nvidia chips difficult. If a cooling system can’t effectively manage chip heat, a processor may reduce its speed for safety, which can compromise computer performance. ATS quadFLOW coolers, drawing cooling air from four directions, are ideal for cooling such 1U and 2U systems and capable of handling a max TDP of 160W. Cooling performance is 20% higher than other coolers.
Provided standard with PEM attachment hardware, quadFLOW coolers are designed to precisely fit the ILM (Independent Loading Mechanism) retention device on Intel LGA 2011 (Socket R) and newer LGA 2066 (Socket R4) CPU sockets. The PEMs align with the mounting hole patterns in the LGA 2011 and LGA 2066 square ILM (80 x 80 MM) CPU sockets. An ATS backing plate allows quadFLOW’s use with AMD, Nvidia and other non-intel CPUs.
The blowers on quadFLOW active CPU coolers have a PWM (pulse width modulation): 10.8 VDC ~ 13.2 VDC operating voltage, with an MTBF of 598,000 hours measured at 40oC. When weight is an issue, choose quadFLOW coolers with aluminum fins. For higher performance, copper fins are available. When higher cooling levels are needed, quadFLOW coolers can be paired with a vapor chamber base.
quadFLOW coolers come with pre-attached Parker Chomerics high performance (3.0 W/m-k thermal conductivity) T670 thermal grease. T670 supports high power applications requiring minimum bond line thickness.
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