Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
MacDermid Alpha to Exhibit, Present at the IMAPS Device Packaging Conference
February 17, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will be exhibiting and presenting a paper at the IMAPS Device Packaging Conference at the WeKoPa Resort and Conference Center, Fountain Hills, AZ, March 7-10, 2022.
Jianwen Han, Principal Research Scientist, will be presenting “Electrochemical Plating System Development of Nano-twinned Cu for Multiple WLP Features”. The paper discusses the development of a series of electrochemical plating baths and processes, generating nano-twinned Cu in wafer-level packaging applications to fulfill the expanding market demand for copper-to-copper direct bonding and hybrid-bonding. This newly developed system shows a high density of nt-Cu (close to 100%), controllable grain size (0.10 to 1.0 micron), vertical columnar structure, and minimal transition layer between Cu seed and nt-Cu initial position.
Featured in the booth will be the MacDermid Enthone brand of product offerings from the Circuitry Solutions division that enable upgraded FCCSP and PCBGA fabrication. Highlighted will be the entire Systek family of high-performance build-up processes for IC Substrates and their integrated leadframe product portfolio which incorporates connected solutions and spans the entire process of building QFN packages from leadframe roughening to enhancing sidewall solderability for enhanced reliability.
The Alpha, Kester, and MacDermid Enthone brands from the Semiconductor division will promote MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications and ATROX CF200-1D an electrically conductive die attach film with thermal conductivity of >20 W/m-K. Also highlighted will be their complete line of STAYSTICK and STAYCHIP adhesives for structural and functional bonding.
The Compugraphics brand, will showcase their complete line of photomask solutions and support services. From 1X master photomasks and reticles to pellicle replacement, MPT coating and photomask cleaning, with quick-turn service, they are a partner you can reply on.
MacDermid Alpha’s team of industry experts from their Circuitry and Semiconductor divisions will be available at booth #23/24 to discuss the challenges the semiconductor and IC substrate manufacturing sectors face as technology continues to push the limits of performance and miniaturization.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.