Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
MacDermid Alpha to Exhibit, Present at the IMAPS Device Packaging Conference
February 17, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will be exhibiting and presenting a paper at the IMAPS Device Packaging Conference at the WeKoPa Resort and Conference Center, Fountain Hills, AZ, March 7-10, 2022.
Jianwen Han, Principal Research Scientist, will be presenting “Electrochemical Plating System Development of Nano-twinned Cu for Multiple WLP Features”. The paper discusses the development of a series of electrochemical plating baths and processes, generating nano-twinned Cu in wafer-level packaging applications to fulfill the expanding market demand for copper-to-copper direct bonding and hybrid-bonding. This newly developed system shows a high density of nt-Cu (close to 100%), controllable grain size (0.10 to 1.0 micron), vertical columnar structure, and minimal transition layer between Cu seed and nt-Cu initial position.
Featured in the booth will be the MacDermid Enthone brand of product offerings from the Circuitry Solutions division that enable upgraded FCCSP and PCBGA fabrication. Highlighted will be the entire Systek family of high-performance build-up processes for IC Substrates and their integrated leadframe product portfolio which incorporates connected solutions and spans the entire process of building QFN packages from leadframe roughening to enhancing sidewall solderability for enhanced reliability.
The Alpha, Kester, and MacDermid Enthone brands from the Semiconductor division will promote MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications and ATROX CF200-1D an electrically conductive die attach film with thermal conductivity of >20 W/m-K. Also highlighted will be their complete line of STAYSTICK and STAYCHIP adhesives for structural and functional bonding.
The Compugraphics brand, will showcase their complete line of photomask solutions and support services. From 1X master photomasks and reticles to pellicle replacement, MPT coating and photomask cleaning, with quick-turn service, they are a partner you can reply on.
MacDermid Alpha’s team of industry experts from their Circuitry and Semiconductor divisions will be available at booth #23/24 to discuss the challenges the semiconductor and IC substrate manufacturing sectors face as technology continues to push the limits of performance and miniaturization.
Share on:
Suggested Items
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.
The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.