Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
February 2022 Issue of PCB007 Magazine Available Now
February 21, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
During IPC APEX EXPO in San Diego, additive and semi-additive processes were a hot topic. But we heard far more questions than answers. Is additive a disruptive PCB technology? Will it displace tried-but-true subtractive etch technology, or is it merely another tool to have in our toolbox? What does a PCB designer have to do differently? Do EDA tools support it?
How much is it going to cost to get into additive processing? Do the numbers really add up? What sort of ROI are we talking about? What equipment am I going to have to acquire in order to begin additive or semi-additive processing? Where’s all of the R&D?
For the February 2022 issue of PCB007 Magazine, we asked a variety of contributors to address some of these questions and share their insights about additive and semi-additive technology.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
Share on:
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.