-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Indium’s Tim Jensen to Participate in iNEMI Technical Series
February 22, 2022 | Indium CorporationEstimated reading time: 2 minutes

Indium’s Tim Jensen, global account manager and senior thermal technologist, will participate in the International Electronics Manufacturing Initiative’s virtual Packaging Tech Topic series, offering his insights into the increased adoption of metal thermal interface materials (TIMs) in high-performance computing at 8 a.m. New York/2 p.m. Berlin/9 p.m. Beijing on Tuesday, March 8.
Managing heat dissipation continues to be a critical part of design as high-performance IC packages advance. With polymeric TIMs reaching physical limits relative to thermal conductivity, there is a need for higher performing materials. Metal TIMs, which have high bulk thermal conductivity, are playing a critical role in addressing this need.
Because there are widely divergent needs for TIMs, five categories of metal TIMs technology are available to address subsets of these needs. In his webinar Proliferation & Advancement of Metal TIMs in High Performance Computing, Jensen will review these material categories, performance attributes, and key assembly parameters to enable attendees to make intelligent decisions on when to consider metal TIMs and which category of metal TIM might be the most appropriate for a given application.
Jensen is a global account manager and senior thermal technologist. In this role, he leads a matrixed team focused on engaging customers and commercializing new technology for the company’s TIMs products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. In his more than 20 years with Indium Corporation, Jensen has led many efforts across printed circuit board assembly, engineered solder materials, and thermal product lines. He has spent years working directly with customers to develop processes and implement new product technologies. Using that direct knowledge and expertise, Jensen worked closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. In addition to his responsibilities at Indium Corporation, he also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. Jensen has a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University.
Download The Printed Circuit Assembler’s Guide to… Solder Defectsby Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).