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Indium’s Tim Jensen to Participate in iNEMI Technical Series
February 22, 2022 | Indium CorporationEstimated reading time: 2 minutes
Indium’s Tim Jensen, global account manager and senior thermal technologist, will participate in the International Electronics Manufacturing Initiative’s virtual Packaging Tech Topic series, offering his insights into the increased adoption of metal thermal interface materials (TIMs) in high-performance computing at 8 a.m. New York/2 p.m. Berlin/9 p.m. Beijing on Tuesday, March 8.
Managing heat dissipation continues to be a critical part of design as high-performance IC packages advance. With polymeric TIMs reaching physical limits relative to thermal conductivity, there is a need for higher performing materials. Metal TIMs, which have high bulk thermal conductivity, are playing a critical role in addressing this need.
Because there are widely divergent needs for TIMs, five categories of metal TIMs technology are available to address subsets of these needs. In his webinar Proliferation & Advancement of Metal TIMs in High Performance Computing, Jensen will review these material categories, performance attributes, and key assembly parameters to enable attendees to make intelligent decisions on when to consider metal TIMs and which category of metal TIM might be the most appropriate for a given application.
Jensen is a global account manager and senior thermal technologist. In this role, he leads a matrixed team focused on engaging customers and commercializing new technology for the company’s TIMs products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. In his more than 20 years with Indium Corporation, Jensen has led many efforts across printed circuit board assembly, engineered solder materials, and thermal product lines. He has spent years working directly with customers to develop processes and implement new product technologies. Using that direct knowledge and expertise, Jensen worked closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. In addition to his responsibilities at Indium Corporation, he also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. Jensen has a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University.
Download The Printed Circuit Assembler’s Guide to… Solder Defectsby Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
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