-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Indium’s Tim Jensen to Participate in iNEMI Technical Series
February 22, 2022 | Indium CorporationEstimated reading time: 2 minutes
Indium’s Tim Jensen, global account manager and senior thermal technologist, will participate in the International Electronics Manufacturing Initiative’s virtual Packaging Tech Topic series, offering his insights into the increased adoption of metal thermal interface materials (TIMs) in high-performance computing at 8 a.m. New York/2 p.m. Berlin/9 p.m. Beijing on Tuesday, March 8.
Managing heat dissipation continues to be a critical part of design as high-performance IC packages advance. With polymeric TIMs reaching physical limits relative to thermal conductivity, there is a need for higher performing materials. Metal TIMs, which have high bulk thermal conductivity, are playing a critical role in addressing this need.
Because there are widely divergent needs for TIMs, five categories of metal TIMs technology are available to address subsets of these needs. In his webinar Proliferation & Advancement of Metal TIMs in High Performance Computing, Jensen will review these material categories, performance attributes, and key assembly parameters to enable attendees to make intelligent decisions on when to consider metal TIMs and which category of metal TIM might be the most appropriate for a given application.
Jensen is a global account manager and senior thermal technologist. In this role, he leads a matrixed team focused on engaging customers and commercializing new technology for the company’s TIMs products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. In his more than 20 years with Indium Corporation, Jensen has led many efforts across printed circuit board assembly, engineered solder materials, and thermal product lines. He has spent years working directly with customers to develop processes and implement new product technologies. Using that direct knowledge and expertise, Jensen worked closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. In addition to his responsibilities at Indium Corporation, he also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. Jensen has a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University.
Download The Printed Circuit Assembler’s Guide to… Solder Defectsby Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.