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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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CIMS Launches Capricorn, Next Generation AVI Solution
February 23, 2022 | CIMSEstimated reading time: Less than a minute
CIMS is launching its next generation AVI solution for IC Substrates based on a brand new platform – Capricorn. The new system features dual stage and dual camera and is powered by the most advanced hardware and software offering high capacity inspection along with greatly enhanced detection capabilities on both metal and solder mask.
Capricorn based multiple resolutions models come in several configurations in order to achieve optimized performance for wide range of ICS strip types. Thanks to the dual camera and high speed automation, Capricorn systems are capable achieving significantly higher throughput at high resolutions.
Furthermore, Capricorn AVI systems are fully compatible with advanced Industry 4.0 requirements including scanning and handling barcode information, internal and external database connectivity, full compatibility with CIMS virtual verification system specifically designed for AVI inspection (VVS/AVI) as well as supporting external data protocols for factory-wide smart factory integration.
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Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
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Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
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