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Atotech to Participate at 18th International Conference & Exhibition on Device Packaging
February 23, 2022 | AtotechEstimated reading time: Less than a minute

Atotech is looking forward to presenting at 18th International Conference & Exhibition on Device Packaging. This international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS) will take place from March 7-10 in Fountain Hills, Arizona.
Our experts are excited to have the opportunity to present the following technical paper:
Thursday, March 10, 2022
Time slot: 10:00 a.m. – 10:30 a.m. (MST)
Presenter: Dr. Britta Schafsteller, Global Product Manager Selective Finishing
Paper topic: How to tailor immersion tin plating for IC substrate applications
Conference:
18th Annual Device Packaging Conference (DPC 2022)
Date: March 7-10, 2022
Venue: WeKoPa Resort and Conference Center in Fountain Hills, Arizona, USA
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Prague PEDC: Call for Abstracts Deadline July 31
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.