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Atotech to Participate at 18th International Conference & Exhibition on Device Packaging
February 23, 2022 | AtotechEstimated reading time: Less than a minute
Atotech is looking forward to presenting at 18th International Conference & Exhibition on Device Packaging. This international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS) will take place from March 7-10 in Fountain Hills, Arizona.
Our experts are excited to have the opportunity to present the following technical paper:
Thursday, March 10, 2022
Time slot: 10:00 a.m. – 10:30 a.m. (MST)
Presenter: Dr. Britta Schafsteller, Global Product Manager Selective Finishing
Paper topic: How to tailor immersion tin plating for IC substrate applications
Conference:
18th Annual Device Packaging Conference (DPC 2022)
Date: March 7-10, 2022
Venue: WeKoPa Resort and Conference Center in Fountain Hills, Arizona, USA
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