Database Now Tracks Integrated Device Manufacturers, 475 Facilities

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SEMI and TechSearch International announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated device manufacturer (IDM) facilities. The database – the only commercially available outsourced semiconductor assembly and testing (OSAT) supplier database available – is an essential business tool for any organization requiring the latest updates on facilities that provide packaging and testing services to the semiconductor industry.

Formerly known as the Worldwide OSAT Manufacturing Sites Database, the comprehensive database now includes more than 100 updates spanning packaging technology, product specialization and ownership/shareholder. With more than 100 new test facility additions to bring the total number of facilities tracked to 475, the database helps semiconductor manufacturers identify service offerings around the globe, an increasingly important task in supply chain management.

“In today’s climate of supply chain disruptions, it is more important than ever to have a good understanding of assembly and test locations,” said Jan Vardaman, president at TechSearch International. “The updated Worldwide Assembly & Test Facility Database is a valuable tool in keeping track of the packaging and assembly ecosystem.”

“Packaging, assembly and test are increasingly becoming key to furthering Moore’s Law through advanced technologies as well as reducing form factor and power consumption as the semiconductor industry continues to drive higher chip performance,” said Sanjay Malhotra, vice president of Corporate Marketing at SEMI. “The Worldwide Assembly & Test Facility Database shows increased focus on advanced packaging and new test capabilities to support innovations in computing, communications and other key end markets.”

Combining the semiconductor industry expertise of SEMI and TechSearch International, the Worldwide Assembly & Test Facility Database update also lists revenues of the world's top 20 OSAT companies and captures changes in technology capabilities and service offerings.

The Worldwide Assembly & Test Facility Database offers insights into facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe and the Americas. The report highlights new and emerging packaging offerings by manufacturing locations and companies. Specific details tracked include 

• Plant site location, technology, and capability: Packaging, Test, and other product specializations, such as sensor, automotive and power devices are highlighted
• Packaging assembly service offered: Ball grid array (BGA), specific leadframe types such as quad flat package (QFP), quad flat no-leads (QFN), small outline (SO), flip-chip bumping, wafer-level package (WLP), Modules/System in Package (SIP), and sensors
• New manufacturing sites announced, planned or under construction

Tracking advances in packaging technology – which directly affects chip performance, reliability, and cost – requires understanding company offerings by location. Key features of the updated report include:

• More than 200 companies and more than 475 total back-end facilities (IDMs and OSATs)
• Over 325 facilities with Test capabilities
• Over 100 facilities offering leadframe chip-scale package (CSP)
• Over 80 bumping facilities, including over 50 with 300mm wafer bumping capacity
• More than 90 facilities offering wafer-level CSP (WLCSP) technology
• New facilities offering fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP)
• Over 110 OSAT facilities in China, over 100 in Taiwan, and over 45 in the Americas
• Over 50 IDM Assembly and Test facilities in Southeast Asia, around 25 in China, and around 20 in the Americas