-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Chris Mitchell's Top 10 Takeaways from IPC APEX EXPO 2022
February 24, 2022 | Chris Mitchell, IPC Vice President of Global Government RelationsEstimated reading time: 1 minute
The recent surge in COVID cases provoked more than a few questions about what to expect at this year’s IPC APEX EXPO. But as I traversed the San Diego Convention Center last week, the top answer was clear: a lot of smiles! Sure, they were hidden behind masks, but they were evident in the eyes of everyone I met. Attendees were thrilled to be back together in person, sharing ideas as freely as elbow bumps. IPC is a community, and APEX EXPO is the place where we build it.
Equally exciting was all the great content on tap for attendees this year. Against that backdrop, here are my top 10 highlights from IPC APEX EXPO 2022, from the perspective of someone engaged in advocating for this industry.
- Hall of Fame Award: Industry stateman Joe O’Neil was this year’s inductee into the IPC Hall of Fame. Joe’s achievements in business are well-recognized. Less recognized is his work for the industry. Joe has served on IPC’s Board of Directors, Government Relations Committee, the IPC Education Foundation board, and the IPC Thought Leaders Program. In his heartfelt and modest speech, Joe thanked the industry titans who mentored him early in his career and challenged everyone to stay on top of industry trends, grow in their careers, and advance the industry. Congratulations to Joe on a well-earned award.
- Technical Conference: Many participants said it was the best technical conference in years. That’s a testament to the IPC staff and volunteers who organized four tracks and set a very high bar for the papers delivered. The four tracks focused on Factory of the Future implementation; PCB fab and materials; quality, reliability, test, and inspection; and assembly materials and environment. Stay tuned for an announcement soon on how you can access these papers and past papers as well.
By the way, a special shout-out is due to Auburn University Ph.D. candidate Mohamed El Amine Belhadi, who along with peers authored the best student paper, “Reliability and IMC Layer Evolution of Homogenous Lead-free Solder Joints During Thermal Cycling.” Auburn is a center of excellence on all things lead-free, including the DoD’s lead-free electronics R&D, for which IPC has secured federal funding.
To read this entire article, which appeared in the Real Time with... IPC APEX EXPO 2022 Show & Tell Magazine, click here.
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.