-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Chris Mitchell's Top 10 Takeaways from IPC APEX EXPO 2022
February 24, 2022 | Chris Mitchell, IPC Vice President of Global Government RelationsEstimated reading time: 1 minute
The recent surge in COVID cases provoked more than a few questions about what to expect at this year’s IPC APEX EXPO. But as I traversed the San Diego Convention Center last week, the top answer was clear: a lot of smiles! Sure, they were hidden behind masks, but they were evident in the eyes of everyone I met. Attendees were thrilled to be back together in person, sharing ideas as freely as elbow bumps. IPC is a community, and APEX EXPO is the place where we build it.
Equally exciting was all the great content on tap for attendees this year. Against that backdrop, here are my top 10 highlights from IPC APEX EXPO 2022, from the perspective of someone engaged in advocating for this industry.
- Hall of Fame Award: Industry stateman Joe O’Neil was this year’s inductee into the IPC Hall of Fame. Joe’s achievements in business are well-recognized. Less recognized is his work for the industry. Joe has served on IPC’s Board of Directors, Government Relations Committee, the IPC Education Foundation board, and the IPC Thought Leaders Program. In his heartfelt and modest speech, Joe thanked the industry titans who mentored him early in his career and challenged everyone to stay on top of industry trends, grow in their careers, and advance the industry. Congratulations to Joe on a well-earned award.
- Technical Conference: Many participants said it was the best technical conference in years. That’s a testament to the IPC staff and volunteers who organized four tracks and set a very high bar for the papers delivered. The four tracks focused on Factory of the Future implementation; PCB fab and materials; quality, reliability, test, and inspection; and assembly materials and environment. Stay tuned for an announcement soon on how you can access these papers and past papers as well.
By the way, a special shout-out is due to Auburn University Ph.D. candidate Mohamed El Amine Belhadi, who along with peers authored the best student paper, “Reliability and IMC Layer Evolution of Homogenous Lead-free Solder Joints During Thermal Cycling.” Auburn is a center of excellence on all things lead-free, including the DoD’s lead-free electronics R&D, for which IPC has secured federal funding.
To read this entire article, which appeared in the Real Time with... IPC APEX EXPO 2022 Show & Tell Magazine, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.