-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Chris Mitchell's Top 10 Takeaways from IPC APEX EXPO 2022
February 24, 2022 | Chris Mitchell, IPC Vice President of Global Government RelationsEstimated reading time: 1 minute

The recent surge in COVID cases provoked more than a few questions about what to expect at this year’s IPC APEX EXPO. But as I traversed the San Diego Convention Center last week, the top answer was clear: a lot of smiles! Sure, they were hidden behind masks, but they were evident in the eyes of everyone I met. Attendees were thrilled to be back together in person, sharing ideas as freely as elbow bumps. IPC is a community, and APEX EXPO is the place where we build it.
Equally exciting was all the great content on tap for attendees this year. Against that backdrop, here are my top 10 highlights from IPC APEX EXPO 2022, from the perspective of someone engaged in advocating for this industry.
- Hall of Fame Award: Industry stateman Joe O’Neil was this year’s inductee into the IPC Hall of Fame. Joe’s achievements in business are well-recognized. Less recognized is his work for the industry. Joe has served on IPC’s Board of Directors, Government Relations Committee, the IPC Education Foundation board, and the IPC Thought Leaders Program. In his heartfelt and modest speech, Joe thanked the industry titans who mentored him early in his career and challenged everyone to stay on top of industry trends, grow in their careers, and advance the industry. Congratulations to Joe on a well-earned award.
- Technical Conference: Many participants said it was the best technical conference in years. That’s a testament to the IPC staff and volunteers who organized four tracks and set a very high bar for the papers delivered. The four tracks focused on Factory of the Future implementation; PCB fab and materials; quality, reliability, test, and inspection; and assembly materials and environment. Stay tuned for an announcement soon on how you can access these papers and past papers as well.
By the way, a special shout-out is due to Auburn University Ph.D. candidate Mohamed El Amine Belhadi, who along with peers authored the best student paper, “Reliability and IMC Layer Evolution of Homogenous Lead-free Solder Joints During Thermal Cycling.” Auburn is a center of excellence on all things lead-free, including the DoD’s lead-free electronics R&D, for which IPC has secured federal funding.
To read this entire article, which appeared in the Real Time with... IPC APEX EXPO 2022 Show & Tell Magazine, click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.