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Indium Corporation to Feature High-Reliability Products for Power Electronics at APEC
February 24, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at APEC 2022, March 20-24, Houston, Texas, U.S.
Indium Corporation offers a robust portfolio of award-winning material solutions for power electronics, supported by its global manufacturing capabilities. These innovative products were developed in collaboration with key equipment partners to provide a solution for current and emerging industry challenges, including those required by automation. The products include:
InFORMS® reinforced solder alloy fabrications improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Indium Corporation’s Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow.
Indium Corporation also offers solutions to ease other aspects of power module manufacturing. InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the need for fixturing during assembly for a lower cost of manufacturing ownership. InTACK™ is uniquely designed for clean flux-free reflow processes, maintaining high tack strength to hold materials in place without residues or the need for extra cleaning steps in the process.
For more information, visit Indium Corporation’s experts at the show at booth #1234.
Download The Printed Circuit Assembler’s Guide to… Solder Defectsby Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
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