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Advanced Electronics Packaging Digest

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Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense

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Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, defense and other demanding systems.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

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Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging

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Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).

Element Solutions, Solstice Advanced Materials End Merger Agreement

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Element Solutions Inc, a global and diversified specialty chemicals technology company, announced that the merger agreement between Element Solutions and Solstice Advanced Materials Inc. has been mutually terminated.

Viscom Inc. to Showcase Latest AI-Powered Inspection Solutions at SMTA Mexico 2026

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Viscom Inc., will present its latest AI-powered inspection solutions at SMTA Mexico 2026, taking place from October 7–8 at the Expo Guadalajara Salón Jalisco.
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