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Scanfil Malmö Factory’s Capabilities for Prototyping Improves Significantly
March 7, 2022 | SeicaEstimated reading time: 1 minute
In April, Malmö becomes the fourth Scanfil factory to adopt Seica V8 automated testing system. The new flying probe replaces the old Takaya system and significantly improves Malmö’s capabilities in prototyping and new product introduction (NPI).
The selected Seica flying probe machine is a state-of-the-art testing device perfect for Scanfil’s high mix – low volume production environment.
“The new Seica V8 flying probe is easier to use, more accurate, and programmable than previous Takaya. It reduces time-to-market significantly compared to the previous system we had. Seica is ideal for Scanfil high mix – low volume production”, says Carl-Johan Forsberg, the managing director of Scanfil Malmö. “The new flying probe increases our capabilities significantly at Malmö and provides a low threshold testing solution for prototype and low volume manufacturing that complements our fixture based ICT and FCT solutions very well.”
After Malmö, Pärnu in Estonia will be the next factory to invest in Seica V8 flying probes. After that, all electronics focused factories are covered. Scanfil selected Seica for all its sites after a careful process.
“Seica fulfilled our needs perfectly and is directly compatible with our Siemens’ MES and Valor process preparation solution. Due to this, it enables us to provide prompt feedback to the design team and allow them to make fast changes in the design,” states Riku Hynninen, the Chief Development Officer of Scanfil. “The unification and increase in capabilities are keys to success at Scanfil. We aim to have unified and state-of-art platforms across our production infrastructure, which creates flexibility in production between sites and also cost benefits”.
Scanfil has nine factories in seven countries across the globe. Scanfil is an international manufacturing partner and system supplier for the electronics industry. Typical Scanfil products are modules or integrated products e.g. self-service applications, automation systems, wireless connectivity modules, climate control systems, collection and sorting systems, analyzers and environmental measurement solutions.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.