-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Cybord Raises $4M Seed Investment Led by IL Ventures to Disrupt the Electronics
March 8, 2022 | PRNewswireEstimated reading time: 2 minutes
Cybord, an innovative software solution that implements AI & Big Data technology, announced that it raised a $4M Seed investment led by IL Ventures, a VC fund focused on transformational technologies for legacy industries, with co-investment by the Israel Innovation Authority.
Electronic components are the base for all electronic circuit boards. Their authenticity, quality, and reliability are at the core of electronic performance. The sophisticated electronics industry (unlike mechanical industries) inspects an insignificant amount of suspected components without traceability, resulting in product failures, high return rates, and large-scale recalls, costing billions of dollars to the OEMs.
Cybord disrupts the industry by setting a new standard. The company delivers advanced AI and Big-Data software that inspects, qualifies, and tracks every component and every electronic board. With Cybord, 100% of components are checked and provide surgical traceability, thus eliminating any possible use of counterfeit, damaged, or tampered components.
"Today, in the midst of the global supply chain crisis, electronic manufacturers across multiple industry verticals struggle to meet ever-growing customer demand while keeping quality a top priority. The need to acquire components in the free market and not only from well-established suppliers increases manufacturers' exposure and vulnerability to significant quality issues. These issues can have direct, sudden, and costly effects on their ability to produce quality products," said Zeev Efrat, CEO at Cybord.
"Cybord's proven technology allows leading industry players to implement the Zero-Trust approach. As the global shortage in electronic components becomes chronic, this becomes a competitive edge which helps our customers generate more revenues, lower their costs, and increase their profitability," added Dr. Eyal Weiss, Cybord's founder, and CTO.
"Cybord's proprietary technology is already deployed, serving FLEX and other global industry leaders at several manufacturing sites globally. The company has made remarkable technological and commercial achievements to date. By now, Cybord scanned over 1.2 billion components while supporting high production volumes with value delivered every day," said Elad Frenkel, Managing Partner at IL Ventures. "We are confident this genuinely disruptive AI technology will change the entire industry, solving a multi-billion-dollar pain of the electronics industry."
The company will use the proceeds from the investment round to advance its R&D and product offering as well as to expedite business growth into additional verticals such as telecom, automotive, defense, and healthcare.
The investment round was led by IL Ventures and joined by NextLeap Ventures, with co-investment by the Israel Innovation Authority (IIA), through the "Seed Fund."
"The purpose of this highly attractive mechanism of the IIA is to increase the number of seed-stage investments, reduce risk and incentivize more experienced, venture capital investors to invest in young, early-stage startups operating in fields involving complex technologies and market disruption," said Karina Rubinstein, Senior Director for Business Development at the IIA.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
Priority Software Appoints Ben Karniel as Chief Revenue Officer to Spearhead Global Growth
06/12/2025 | Priority SoftwarePriority Software, a leading provider of scalable and agile cloud-based business management solutions, proudly announces the appointment of Ben Karniel as its new Chief Revenue Officer (CRO), effective May 1, 2025. This strategic addition to the executive team underscores Priority's commitment to expand its global footprint.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.