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Arlon Takes on Role as EMC Master Distributor in North America
March 10, 2022 | Arlon EMDEstimated reading time: 1 minute
Arlon EMD, a division of Elite Materials Company (EMC), and an American manufacturer of specialty laminates is assuming the role of Master Distributor for EMC materials in N. America. Arlon has a 45-year history of manufacturing specialty materials for the Aerospace, Industrial and Military (AIM) markets.
This Master Distributor realignment will support the continued growth of EMC sales in N. America to meet customer demand of EMC products and provide shorter lead times. Arlon will assist with analytical and testing services on EMC laminates and prepregs. Arlon’s Q.A. testing capabilities, warehousing and manufacturing operation in Southern California will enable EMC to expand and centralize their logistical functions.
As the Master Distributor for EMC, Arlon will become the hub of importation for EMC laminates and prepregs. Arlon will use direct Arlon sales personnel, distributors, and agents to support fabricators’ requirements for EMC and Arlon specialty materials. As of June 1, 2022, fabrication customers may begin placing orders directly with Arlon or with one of Arlon’spartner distributors.
Elite Material Co. Ltd. (EMC) established in 1992 as a copper clad (CCL) and prepreg manufacturer, has become the global leader in the manufacture and supply of Halogen free CCL materials. Elite’s highly skilled Research & Development team has developed a family of materials from mid-loss to extreme low loss products. These materials are designed in complex PCB’s; mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products.
EMC has filed more than 250 patents globally, becoming a “technology leader” in Mobile Communications, AI, Cloud Computing Data Centers, 5G Infrastructure Network, Electric Vehicle (EV) and Autonomous Driving applications.
For more information visit www.arlonemd.com.
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10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
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MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
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Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
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MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
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