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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Arlon Takes on Role as EMC Master Distributor in North America
March 10, 2022 | Arlon EMDEstimated reading time: 1 minute
Arlon EMD, a division of Elite Materials Company (EMC), and an American manufacturer of specialty laminates is assuming the role of Master Distributor for EMC materials in N. America. Arlon has a 45-year history of manufacturing specialty materials for the Aerospace, Industrial and Military (AIM) markets.
This Master Distributor realignment will support the continued growth of EMC sales in N. America to meet customer demand of EMC products and provide shorter lead times. Arlon will assist with analytical and testing services on EMC laminates and prepregs. Arlon’s Q.A. testing capabilities, warehousing and manufacturing operation in Southern California will enable EMC to expand and centralize their logistical functions.
As the Master Distributor for EMC, Arlon will become the hub of importation for EMC laminates and prepregs. Arlon will use direct Arlon sales personnel, distributors, and agents to support fabricators’ requirements for EMC and Arlon specialty materials. As of June 1, 2022, fabrication customers may begin placing orders directly with Arlon or with one of Arlon’spartner distributors.
Elite Material Co. Ltd. (EMC) established in 1992 as a copper clad (CCL) and prepreg manufacturer, has become the global leader in the manufacture and supply of Halogen free CCL materials. Elite’s highly skilled Research & Development team has developed a family of materials from mid-loss to extreme low loss products. These materials are designed in complex PCB’s; mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products.
EMC has filed more than 250 patents globally, becoming a “technology leader” in Mobile Communications, AI, Cloud Computing Data Centers, 5G Infrastructure Network, Electric Vehicle (EV) and Autonomous Driving applications.
For more information visit www.arlonemd.com.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.