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SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements
March 14, 2022 | SHENMAO America, Inc.Estimated reading time: 1 minute
SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
The Halogen-free (ROL0) paste complies with RoHS, RoHS 2.0 and REACH, offering excellent voiding performance and good printability. PF918-P250 has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied. With the innovative flux design, voiding easily can be controlled to less than 10 percent.
PF918-P250 can increase thermal reliability performance by a minimum of 30 percent. It provides better mechanical shock performance than typical solder alloys such as SAC305 and SAC405 and is suitable for use in consumer electronics, servers and automotive electronics applications.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
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