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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Insulectro Hires Industry Veteran Doug Gotelli as Technical Account Manager for Silicon Valley
March 15, 2022 | InsulectroEstimated reading time: 1 minute
Insulectro, the largest distributor of materials for use in manufacture of printed circuit boards and printed electronics, has hired Doug Gotelli as Technical Account Manager in its San Jose Branch.
“Today, I’m welcoming Doug Gotelli to the Puma Team,” announced Ken Parent, Insulectro Chief Operating Officer, “Doug has had a very impressive career with many high-profile positions throughout the supply chain.”
Gotelli has an extensive background in PCB fab/assembly/integration/supply sales and account management with such firms as Compass Electronics Solutions, MacDermid Alpha, Minco Products, Endicott Interconnect, and Tyco.
"I’ve known Insulectro since my start in the PCB business. The first ‘business lunch’ of my career was with Tom Earle and Anne Garibaldi when I worked in procurement/purchasing at a small PCB factory back in 1979! From that day on, I’ve had such respect and admiration for Insulectro. To have the opportunity of joining Insulectro at this juncture in my career is both extraordinary and humbling," Gotelli commented.
Gotelli will report to Chris Hunrath, Insulectro VP of Technology. Hunrath’s responsibilities have recently increased with the sales leadership role for Northern and Southern California being added. In addition to his Technology title, Hunrath is now also Vice President of Sales – Western Region.
Ken Parent concluded, “Doug's enviable track record is pinned to his driving goal of long-term customer engagement. We’re glad he’s now carrying an Insulectro business card.”
Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech, JX Nippon, TADCO, EMD Performance Materials (Ormet®), Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, InduBond®, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex, and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.
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Brent Fischthal - Koh YoungSuggested Items
Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference
05/01/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
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From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
Sanmina Reports Q2 Fiscal 2026 Financial Results
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