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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Call for Papers EIPC Summer Conference Örebro, Sweden 2022
March 23, 2022 | EIPCEstimated reading time: Less than a minute
Not so much a garden, more a gathering, and a long-overdue reunion at that. On 14th & 15th June EIPC will be hosting their summer conference in the lovely city of Örebro, and we are sending to you our Call for Papers. The list of topics is prodigious, but then so too is the amount of time that has passed since we last able to hold such an event. There is much to catch up on, which is why we are anxious to ensure that we can have the best presentations possible.
There will be a visit to the Ericsson Product Development Centre in Kumla during the two days, and as usual there will be the warm hospitality and conviviality that is habitual at an EIPC ‘ Networking dinner!
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Klaus Koziol - atgSuggested Items
It’s Only Common Sense: Stop Managing and Start Teaching
02/23/2026 | Dan Beaulieu -- Column: It's Only Common SenseSomehow, businesses have forgotten what leadership was about. We’ve replaced mentorship with metrics, traded coaching for control, and begun referring to people as “resources,” as if they were parts on a shelf instead of people capable of learning, growing, and expanding their impact.
Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
02/18/2026 | Anaya Vardya -- Column: Standard of ExcellenceThe future of PCB manufacturing is here. The products we’re being asked to build today would have been called “advanced” just a few years ago. What was once special is now standard, and what was once impossible is now expected. The challenge and the opportunity lie in leading the charge to the next frontier of printed circuit board design, materials, and manufacturing discipline. To build the board of the future, we need new materials, smarter methods, and a mindset of innovation anchored in flawless execution.
It’s Only Common Sense: Are Your Favorite Customers Holding You Back?
12/22/2025 | Dan Beaulieu -- Column: It's Only Common SenseSome of your best customers are your worst problems. You know the ones I’m talking about, those who have been with you forever, supported you from the beginning, know how you work, and, if you’re honest, treat you like an employee instead of a partner. They call you at all hours, squeeze every nickel, demand miracles, and then act like you owe them for the privilege of their business.
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
10/08/2025 | Markus Voeltz -- Column: Global PCB ConnectionsNot every PCB fabricator is a good fit for every design. This is something many seasoned OEMs and greenhorn designers learn the hard way. The industry is full of talented board shops: global giants, regional specialists, niche fabricators, and everything in between. But even the best shop can fail a job if it's not the right fit for that specific board, volume, or customer requirement.
BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services
08/22/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.