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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IEC Announces Partnership with TUC
March 29, 2022 | IECEstimated reading time: 1 minute
IEC proudly presents another new partnership with innovative laminate and prepreg manufacturer, Taiwan Union Technology Corporation (TUC). TUC’s headquarters are in Jhubei, Taiwan, with locations also located in Changshu and Zhongshan in China. With over 45 years in business, and with a focus on research and development, TUC provides superior quality to the PCB industry.
Shawn Stone, president of IEC says, “We’re proud to be working with our Taiwanese partner TUC exclusively in North America. We trust this will help our customers across North America to bolster their continuous supply of copper clad laminates during these challenging times.”
TUC specializes in value-added materials and mass lamination services to the global electronics industry. Featuring the best raw materials, and manufacturing standards, they produce consistent and reliable products that feature high speed, low loss environmentally friendly, lead-free compatible, and halogen-free, among other variables important to our customers. Additionally, TUC possesses several international quality certificates: QC080000 IECQ HSPM, Sony Green Partner, ISO 14001, ISO/IATF 16949, ISO 9001, and ISO 45001. Building on integrity, TUC brings not only competitive pricing but quick turn and short lead time availability, maximizing their customer’s need to deliver on time.
IEC will be part of that philosophy. With stocking locations in Santa Clara, CA, Chicago, IL, Norristown, PA, and Toronto, ON, IEC has entered into a stock and service relationship with TUC and will be providing logistics services on their behalf.
John Strubbe, Vice President of Technology, says, "We are elated with this partnership to cover North America. This will ensure expedient services for our customers utilizing our disciplined technical resources, methods, and state of the art manufacturing facilities. TUC developed a system for Signal Integrity Measurement Technology which is a proprietary electrical analyzer, where we can package our resin portfolio and copper foils to meet electrical and thermal reliability for various customers applications."
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Sweeney Ng - CEE PCBSuggested Items
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04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.