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IEC Announces Partnership with TUC
March 29, 2022 | IECEstimated reading time: 1 minute
IEC proudly presents another new partnership with innovative laminate and prepreg manufacturer, Taiwan Union Technology Corporation (TUC). TUC’s headquarters are in Jhubei, Taiwan, with locations also located in Changshu and Zhongshan in China. With over 45 years in business, and with a focus on research and development, TUC provides superior quality to the PCB industry.
Shawn Stone, president of IEC says, “We’re proud to be working with our Taiwanese partner TUC exclusively in North America. We trust this will help our customers across North America to bolster their continuous supply of copper clad laminates during these challenging times.”
TUC specializes in value-added materials and mass lamination services to the global electronics industry. Featuring the best raw materials, and manufacturing standards, they produce consistent and reliable products that feature high speed, low loss environmentally friendly, lead-free compatible, and halogen-free, among other variables important to our customers. Additionally, TUC possesses several international quality certificates: QC080000 IECQ HSPM, Sony Green Partner, ISO 14001, ISO/IATF 16949, ISO 9001, and ISO 45001. Building on integrity, TUC brings not only competitive pricing but quick turn and short lead time availability, maximizing their customer’s need to deliver on time.
IEC will be part of that philosophy. With stocking locations in Santa Clara, CA, Chicago, IL, Norristown, PA, and Toronto, ON, IEC has entered into a stock and service relationship with TUC and will be providing logistics services on their behalf.
John Strubbe, Vice President of Technology, says, "We are elated with this partnership to cover North America. This will ensure expedient services for our customers utilizing our disciplined technical resources, methods, and state of the art manufacturing facilities. TUC developed a system for Signal Integrity Measurement Technology which is a proprietary electrical analyzer, where we can package our resin portfolio and copper foils to meet electrical and thermal reliability for various customers applications."
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.