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EVS International Teams Up with ARK Mfg. in Arizona, New Mexico & Southern Nevada
March 30, 2022 | EVS InternationalEstimated reading time: 1 minute
EVS International, the leader in solder recovery, is pleased to announce the appointment of ARK Manufacturing Solutions, LLC as its manufacturers’ representative. Dave Murrin, President and principal owner of ARK Mfg., will represent EVS’ solder recovery systems in Arizona, New Mexico, and Southern Nevada.
“We are really excited to partner with Dave,” stated Simon Norman, Business Director at EVS. “His knowledge of the industry and experience made this an easy choice.”
Formerly Phoenix Marketing Representatives, ARK Mfg. Solutions has been in business for more than 20 years, having had the good fortune to represent some of the best manufacturers in the electronics industry and serve the best customer base in the market.
EVS’ new Solder Recovery Systems are fully lead-free compatible. Lead-free solder is used around the world and many EVS customers are using the EVS Solder Recovery Systems on all types of lead-free alloys (SAC305, SN100 and SAC X ECT). In Europe, the European Union has eliminated the use of lead from the electronics industry completely.
The price of lead-free solder is three to four times that of present leaded solder so the savings and payback from using EVS technology has leaped forward, making solder recovery the fastest payback of all circuit board assembly capital purchases.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.