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ZDI Partner, Epoch International, to Exhibit in Del Mar
April 5, 2022 | Zero Defects InternationalEstimated reading time: Less than a minute
Zero Defects International (ZDI) has announced Epoch International's participation as an exhibitor in the 2022 Del Mar Electronics and Manufacturing Show. This exposition will be held May 4-5 at the Del Mar Fairgrounds in San Diego, California.
Epoch's exhibit, in Booth 109, will feature the company's electronic contract manufacturing capabilities in both the Fremont, CA and Dalian, China facilities. As a strategic partner, ZDI will have personnel joining the Epoch exhibition team for each day of the show.
Suggested Items
Biden-Harris Administration: CHIPS Incentives Award to TSMC Arizona
11/15/2024 | U.S. Chamber of CommerceTSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Foxconn Posts Q3 2024 Financial Results
11/15/2024 | FoxconnRevenue reached NT$1.85 trillion, and for the cumulative January-September period revenue totaled NT$4.7 trillion, both setting new highs for the same period compared to previous years.
Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
11/14/2024 | The Occam GroupThe Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.
Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology
11/14/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2
11/14/2024 | I-Connect007 Editorial TeamThe guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.