Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at SMT Connect Trade Fair
April 6, 2022 | ITW EAEEstimated reading time: 1 minute
ITW EAE will be showcasing its latest developments at SMT Connect, May 10-12 in Nuremburg, Germany. The ITW EAE booth 4-205 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications experts on hand as well as Sales and Management to answer questions and offer solutions.
Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This new and innovative system reduces wet out areas and improves capillary flow for underfill and provides access to dispense on side walls, underneath, or around tall components. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows articulation of the dispense pump in sub-degree increments in both axes for total flexibility.
MPM will be presenting live demonstrations of the Edison II ACT (Automatic Changeover Technology) which is in the final stage of development. This innovative patent pending technology provides a simple, cost-effective solution that can be implemented in progressive stages towards full automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The solution utilizes an Edison printer and a cost-effective pairing cart designed to automate the changeover of solder paste cartridges, support tooling, squeegees, and stencils.
MPM will also have the top-performing Momentum II Elite on display. This proven, highly productive printer platform was recently updated with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
ITW EAE will also share advancements they have made on interface solutions for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.