-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at SMT Connect Trade Fair
April 6, 2022 | ITW EAEEstimated reading time: 1 minute
ITW EAE will be showcasing its latest developments at SMT Connect, May 10-12 in Nuremburg, Germany. The ITW EAE booth 4-205 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications experts on hand as well as Sales and Management to answer questions and offer solutions.
Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This new and innovative system reduces wet out areas and improves capillary flow for underfill and provides access to dispense on side walls, underneath, or around tall components. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows articulation of the dispense pump in sub-degree increments in both axes for total flexibility.
MPM will be presenting live demonstrations of the Edison II ACT (Automatic Changeover Technology) which is in the final stage of development. This innovative patent pending technology provides a simple, cost-effective solution that can be implemented in progressive stages towards full automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The solution utilizes an Edison printer and a cost-effective pairing cart designed to automate the changeover of solder paste cartridges, support tooling, squeegees, and stencils.
MPM will also have the top-performing Momentum II Elite on display. This proven, highly productive printer platform was recently updated with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
ITW EAE will also share advancements they have made on interface solutions for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.