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Advanced Electronics Packaging Digest

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TI Introduces ADC for Faster Telemetry in AI Data Centers

10/12/2026 | PRNewswire
At the Open Compute Project (OCP) Global Summit, Texas Instruments (TI) debuted the first analog-to-digital converter (ADC) to enable 24/7, low-power, event-based remote monitoring at nanosecond resolution.

Vietjet Air Expands Contract with RTX’s Collins Aerospace

10/12/2026 | Collins Aerospace
Collins Aerospace, an RTX business, has expanded its contract with Vietjet Air to include FlightSense™, which provides technical and maintenance solutions for the airline’s additional 44 GTF-powered Airbus A320neo family aircraft.

Global Electronics Association Releases IPC-1783-CO2E Standard for Product Carbon Footprint Data

10/09/2026 | Global Electronics Association
The Global Electronics Association announced the release of IPC-1783-CO2E, International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, a new global standard designed to bring greater consistency, credibility and comparability to product carbon footprint data across the electronics industry.

Six Suppliers Bet on VCSEL NPO as Demand Hits 650 Million Units by 2031

10/09/2026 | TrendForce
TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO).

What Climate Week NYC Conversations Mean for the Electronics Industry

10/09/2026 | Kelly Scanlon and Seth Jacobsen, Global Electronics Association
Climate Week NYC brought together plenty of big ideas, but the conversations that stayed with us were grounded in everyday business realities. Companies are thinking about sustainability in terms of what it means for their ability to manage risk, keep costs in check, secure materials and energy, and remain competitive. That is particularly relevant for electronics. Our industry relies on global supply chains, specialized materials, dependable infrastructure, and skilled people. As demand for AI, computing capacity, and new technologies grows, so does the pressure on all those systems.
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