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Peters Strengthens Canada/US Market with MATRIX
April 18, 2022 | Lackwerke Peters GmbH & Co. KGEstimated reading time: 2 minutes
MATRIX Electronics, Ltd., based in Mississauga/Canada, will become the exclusive distributor for ELPEPCB® products from Lackwerke Peters, Kemp-en/Germany, effective April 18 , 2022. The ELPEPCB® portfolio includes photoimageable Elpemer® solder resist, thermal conductive pastes, carbon conductive resists, etching and electroplating resists, plugging pastes and marking inks. Peters ELPEPCB® products are market leading materials characterized by excellent adhesion, high surface hardness and their environmental compatibility meeting and exceeding all relevant industry standards such as UL94 V-0 or IPC-SM-840E, Class H and T.
MATRIX Electronics is the ideal partner for Peters and is one of North America’s leading distributors and manufacturers of high quality materials for the printed circuits industry., Established in 1977 Matrix headquarters is located in Mississauga, Canada, a suburb of Toronto. MATRIX have five fast-response warehouses in the U.S. and Canada that fulfill high-quality, quick-delivery, custom orders on a daily basis. Matrix supports nearly every PCB fabricator in this market area and has been ranked number 1 in customer service and support by the largest fabricators in North America.
The two CEOs Kieran Healy (MATRIX) and Ralf Schwartz (Peters) are delighted with this new opportunity to work together in North America. Peters benefits from the deep experience and market penetration that Matrix offers and Matrix gains the global market leading ELPEPCB® brand to enhance the choices available to this important market.
Ralf Schwartz explains: "In recent years, our priority has been ELPEGUARD protective coatings for electronic manufacturing service companies, which we have been successfully selling throughout North America together with our long-standing American partner company Paradign.
Markus Wieler, Manager for Global Business Development at Peters, adds: "With MATRIX, we have gained an excellent partner with whom we will achieve our ambitious goals in the USA and Canada. After all, PCB production outside Asia will again gain significantly in importance“
MATRIX-President Kieran Healy states: The Peters Group has gained significant market share in the European market and a growing share in Asia with the ELPEPCB® product line. Their products are leading edge in their performance, long term reliability, environmental saftey, and value to the PCB marketplace, We are excited to add these products to our current portfolio and grow Peter‘s share in this important North American Market.“
With the completion of the Canada/US market regarding ELPEPCB® Peters completes its international sales network sustainably. Lackwerke Peters, a company of the Peters Group with its own service and sales companies in China, Taiwan and Southeast Asia, develops, produces and distributes - and this is unique worldwide - all coating materials for the manufacture of PCBs as well as for the protection of assembled printed circuit boards. In addition to the high-quality Elpemer solder mask, important "niche products" such as peelable soldermasks, hole filler, carbon conductive coatings and heat sink pastes are in high demand worldwide.
MATRIX, with offices in Toronto, Santa Ana, Santa Clara, Chicago, Minnesota and Osaka, is a leading supplier of raw materials and consumables such as thermally robust substrates, multilayer PCB systems, flexible PCB solutions for PCB manufacturing and phototools. Both CEOs agree on the now sealed transatlantic alliance: an ideal partnership between two strong teams.
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Brent Fischthal - Koh YoungSuggested Items
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.