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Catch the KYZEN Clean Team at Three SMTA Expos in May
April 18, 2022 | KYZEN'Estimated reading time: Less than a minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Oregon, Michigan and Capital Expos in May to discuss its new AQUANOX A4626 Next Generation Aqueous Cleaning Solution. The SMTA Oregon Expo will take place Tuesday, May 3, 2022, in Wilsonville, OR. The SMTA Michigan Expo is scheduled to take place Tuesday, May 17, 2022, in Liviona, MI. Lastly, the SMTA Capital Expo will be held Tuesday, May 24, 2022, in Laurel, Maryland.
AQUANOX A4626 is the newest addition to the award-winning AQUANOX product line. The next-generation cleaning chemistry is designed to quickly remove the latest polymeric no-clean flux residues, while providing superior results on traditional lead-free and eutectic tin-lead residues as well.
The environmentally friendly AQUANOX A4626 removes all of the latest as well as traditional flux residues. It has a long tank life and is safe for multi-pass applications.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst paired with KYZEN Analyst Data Services will complete the optimization and provide you with a worry-free process.
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Rachael Temple - AlltematedSuggested Items
Taking Control of PCB Verification One Step at a Time
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Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
10/06/2025 | Happy Holden -- Column: Happy’s Tech TalkIn over 50 years as a PCB process engineer, the one skill I acquired in college that has been most beneficial is engineering statistics. Basic statistics was part of my engineering fundamentals classes, but I petitioned the dean to let me take the engineering statistics graduate course because I was creating a senior thesis for my honors focus and needed more training on Design of Experiments (DOE).
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.