Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Catch the KYZEN Clean Team at Three SMTA Expos in May
April 18, 2022 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Oregon, Michigan and Capital Expos in May to discuss its new AQUANOX A4626 Next Generation Aqueous Cleaning Solution. The SMTA Oregon Expo will take place Tuesday, May 3, 2022, in Wilsonville, OR. The SMTA Michigan Expo is scheduled to take place Tuesday, May 17, 2022, in Liviona, MI. Lastly, the SMTA Capital Expo will be held Tuesday, May 24, 2022, in Laurel, Maryland.
AQUANOX A4626 is the newest addition to the award-winning AQUANOX product line. The next-generation cleaning chemistry is designed to quickly remove the latest polymeric no-clean flux residues, while providing superior results on traditional lead-free and eutectic tin-lead residues as well.
The environmentally friendly AQUANOX A4626 removes all of the latest as well as traditional flux residues. It has a long tank life and is safe for multi-pass applications.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst paired with KYZEN Analyst Data Services will complete the optimization and provide you with a worry-free process.
Share on:
Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.