Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Indium Corporation to Feature Proven Products for Advanced Packaging at ECTC
April 20, 2022 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, California, U.S.
As advanced packaging techniques continue to evolve within the industry, it is necessary that materials be able to withstand the placement of complex dies into smaller and smaller packages. Indium Corporation works collaboratively with customers and other industry leaders to develop cutting-edge solutions for current and emerging advanced packaging challenges.
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation’s technical experts have developed an industry-proven advanced packaging portfolio designed to provide enhanced reliability in heterogeneous integration and assembly and system-in-package (SiP) applications.
As an industry leader in high-performance liquid metal-based thermal interface materials (TIM), Indium Corporation will also feature selections from its portfolio of innovative high-performance metal TIM solutions. With its portfolio of alloys that are liquid at or near room temperature, Indium Corporation’s liquid metal TIMs are designed to offer superior thermal conductivity for both TIM0 and TIM1 applications.
Solder paste solutions to be featured include:
- Durafuse HT, a new mixed-alloy technology designed as a drop-in solution to replace and outperform the traditional high-Pb solders in die-attach and clip-bond for power discrete applications.
- SiPaste, an ultrafine-pitch solder paste series specifically designed for fine feature printing. SiPaste C201HF is specifically formulated to accommodate fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields.
- LEDPaste NC38HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, especially for mini- or micro-LED applications. It combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for the smallest LED applications. It also delivers high tackiness and is available in a wide range of alloys, including Ag-free options.
Flux solutions to be featured include:
- NC-809, a halogen-free, ultra-low residue, flip-chip flux designed to hold die or solder spheres in place without risk of die shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes.
- NC-702 is an award-winning no-clean, near-zero residue, halogen-free material solution designed with the tack strength to hold parts in place during placement and reflow processes. NC-702 is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps.
Indium Corporation also offers a wide array of proven no-clean fluxes designed for today’s industry challenges, such as electronics devices in applications from the Internet of Things (IoT) to mobile devices and next-generation applications.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.